ORIOL, INC.
Patent Owner
Stats
- 11 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Oct 23, 2012 most recent publication
Details
- 11 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 1,336 Total Citation Count
- Feb 08, 2001 Earliest Filing
- 18 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
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Top Patents (by citation)
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Recent Patents
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Intl Class
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2008/0038,992 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersAbandonedMar 05, 07Feb 14, 08[B24B]
7225864 Multi-channel temperature control system for semiconductor processing facilitiesExpiredApr 06, 01Jun 05, 07[F24F]
2007/0051,818 Semiconductor processing temperature controlAbandonedSep 21, 06Mar 08, 07[H01L, H05B, G05D, F25B, F24F]
7186165 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersExpiredJul 28, 06Mar 06, 07[B24B]
2006/0281,393 Chemical mechanical polishing tool, apparatus and methodAbandonedJun 10, 05Dec 14, 06[B24B]
7104867 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersExpiredDec 22, 05Sep 12, 06[B24B]
7069984 Multi-channel temperature control system for semiconductor processing facilitiesExpiredFeb 08, 01Jul 04, 06[F25B]
7004815 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersExpiredJun 10, 05Feb 28, 06[B24B]
6949177 System and method for processing semiconductor wafers using different wafer processesExpiredAug 16, 01Sep 27, 05[B24B]
6949466 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery linesExpiredSep 18, 01Sep 27, 05[H01L]
6942545 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersExpiredApr 20, 01Sep 13, 05[B24B]
6835118 Rigid plate assembly with polishing pad and method of usingExpiredDec 14, 01Dec 28, 04[B24D]
6575818 Apparatus and method for polishing multiple semiconductor wafers in parallelExpiredJun 27, 01Jun 10, 03[B24B]
6561881 System and method for chemical mechanical polishing using multiple small polishing padsExpiredMar 15, 01May 13, 03[B29B]
2003/0022,498 CMP system and method for efficiently processing semiconductor wafersAbandonedJul 27, 01Jan 30, 03[H01L, C23F]
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