ORTHODYNE ELECTRONICS CORPORATION

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2469
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 11351
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 256
 
  
 
B23H WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL 120
 
  
 
B23Q DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING 139
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
  
 
B24D TOOLS FOR GRINDING, BUFFING, OR SHARPENING 129
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES 125
 
  
 
B65D CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES 197

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2015/0144,682 WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAMEJan 28, 15May 28, 15[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9527189 Systems and methods for processing solar substratesSep 26, 14Dec 27, 16[B24B, B08B, B24D]
9393641 Methods and systems for aligning tooling elements of ultrasonic bonding systemsDec 21, 11Jul 19, 16[H01L, B23K, G06T]
9216527 Solid-dielectric switch including a molded viewing windowMay 21, 12Dec 22, 15[B29C, B29L, H01H]
9038998 Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operationsNov 16, 10May 26, 15[B23Q, H01L]
8998063 Wire loop forming systems and methods of using the sameJan 22, 13Apr 07, 15[H01L, B23K]
8926760 Systems and methods for processing solar substratesFeb 19, 10Jan 06, 15[H01L, B08B]
8820609 Wire bonding toolSep 13, 12Sep 02, 14[B23K]
8746537 Ultrasonic bonding systems and methods of using the sameOct 22, 13Jun 10, 14[B23K]
8720767 Semiconductor device support for bondingNov 19, 09May 13, 14[B23K]
8685789 Ribbon bonding in an electronic packageMay 07, 10Apr 01, 14[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0119,111 RIBBON BONDING TOOLS AND METHODS OF USING THE SAMEAbandonedJan 10, 13May 16, 13[B23K]
2013/0019,458 SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICEAbandonedApr 12, 11Jan 24, 13[H01L]
2011/0290,859 RIBBON BONDING TOOLS AND METHODS OF USING THE SAMEAbandonedFeb 05, 10Dec 01, 11[B23K]
4976392 Ultrasonic wire bonder wire formation and cutter systemExpiredAug 11, 89Dec 11, 90[B23K]
4824005 Dual mode ultrasonic generator in a wire bonding apparatusExpiredAug 13, 86Apr 25, 89[B23K]
4438880 Ultrasonic wire bond touchdown sensorExpiredAug 17, 81Mar 27, 84[B23K]
4288023 Parts storage and handling systemExpiredJul 12, 79Sep 08, 81[B65G]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.