OVID DATA CO. LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 16346
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 8148
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 5128
 
  
 
B44F SPECIAL DESIGNS OR PICTURES110
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6205654 Method of manufacturing a surface mount packageDec 28, 98Mar 27, 01[H05K]
6194247 Warp-resistent ultra-thin integrated circuit package fabrication methodSep 23, 98Feb 27, 01[H01L]
5895232 Three-dimensional warp-resistant integrated circuit module method and apparatusJul 07, 97Apr 20, 99[H01L]
5864175 Wrap-resistant ultra-thin integrated circuit package fabrication methodMay 10, 96Jan 26, 99[H01L]
5843807 Method of manufacturing an ultra-high density warp-resistant memory moduleJul 25, 96Dec 01, 98[H01L]
5828125 Ultra-high density warp-resistant memory moduleDec 02, 96Oct 27, 98[B44F, C23F]
5801437 Three-dimensional warp-resistant integrated circuit module method and apparatusAug 11, 95Sep 01, 98[H01L]
5783464 Method of forming a hermetically sealed circuit lead-on packageFeb 11, 97Jul 21, 98[H01L]
5702985 Hermetically sealed ceramic integrated circuit heat dissipating package fabrication methodOct 19, 94Dec 30, 97[H01L]
5654877 Lead-on-chip integrated circuit apparatusAug 18, 95Aug 05, 97[H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7737549 Circuit module with thermal casing systemsExpiredOct 31, 08Jun 15, 10[H01L, H05K]
7180167 Low profile stacking system and methodExpiredDec 14, 04Feb 20, 07[H01L]
7026708 Low profile chip scale stacking system and methodExpiredJul 11, 03Apr 11, 06[H01L]
6919626 High density integrated circuit moduleExpiredJan 16, 01Jul 19, 05[H01L]

Top Inventors for This Owner

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