Oerlikon Assembly Equipment AG, Steinhausen

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8133823 Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrateOct 08, 08Mar 13, 12[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0224,715 WIRE SUPPLY DEVICE FOR A WIRE BONDERAbandonedJun 04, 07Sep 09, 10[H01L, B65H]
2010/0018,643 Method And Apparatus For Mounting A Piece Of Foil On A SubstrateAbandonedJan 23, 09Jan 28, 10[B32B]
2009/0271,978 Foil Perforating Needle For Detaching A Small Die From The FoilAbandonedOct 31, 08Nov 05, 09[H05K]
7597234 Method for mounting a flip chip on a substrateExpiredDec 22, 06Oct 06, 09[H01L, B23K]
2009/0218,385 WIRE BONDERAbandonedFeb 26, 09Sep 03, 09[B23K]
2009/0144,968 Pick-Up Tool And Method For Grasping And Mounting Small DiesAbandonedOct 31, 08Jun 11, 09[H01L, H05K]
2009/0070,992 Pick And Place System For A Semiconductor Mounting ApparatusAbandonedSep 08, 08Mar 19, 09[H05K]
2008/0314,264 Device For Pressing On Semiconductor Chips Arranged On A SubstrateAbandonedJun 20, 08Dec 25, 08[B30B]
2008/0308,609 BOND HEAD FOR A WIRE BONDERAbandonedJun 06, 08Dec 18, 08[B23K]
2008/0302,857 WIRE CLAMP FOR A WIRE BONDERAbandonedJun 05, 08Dec 11, 08[B23K]
2007/0017,638 Device for applying adhesive to a substrateAbandonedJul 25, 06Jan 25, 07[G05G]

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