PAC TECH - PACKAGING TECHNOLOGIES GMBH

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2667
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 18344
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 4155
 
  
 
A43B CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR134
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
F26B DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM 129
 
  
 
G01K MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR 145

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0165,772 SOLDER BALL FEEDING DEVICEJul 15, 15Jun 15, 17[B23K]
2017/0165,773 DEVICE FOR THE SEPARATE APPLICATION OF BONDING MATERIAL DEPOSITSJul 15, 15Jun 15, 17[B23K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9685423 Semiconductor chip assembly and method for manufacturing the sameJan 22, 14Jun 20, 17[H01L, B23K]
9649711 Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux mediumJan 30, 12May 16, 17[H01L, B23K]
9401298 Method and device for transferring a chip to a contact substrateApr 10, 06Jul 26, 16[H01L]
9327360 Method and device for contacting, positioning and impinging a solder ball formation with laser energyJan 24, 08May 03, 16[B23K, H05K]
8988094 Test contact arrangementMar 27, 09Mar 24, 15[G01R]
8742571 Diode array and method for producing a diode arraySep 15, 10Jun 03, 14[H01L]
8497578 Terminal face contact structure and method of making sameMar 10, 09Jul 30, 13[H01L]
8480298 Device for positioning and contacting test contactsOct 05, 09Jul 09, 13[G01K]
8361881 Method for alternately contacting two wafersMar 29, 11Jan 29, 13[H01L]
8328068 Transfer device for receiving and transferring a solder ball arrangementApr 17, 08Dec 11, 12[B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0087,539 Method and Device for Forming Solder DepositsAbandonedApr 13, 11Apr 11, 13[B23K]
2012/0126,410 Contact Array for Substrate ContactingAbandonedNov 05, 09May 24, 12[H01L]
7481352 Method for ablating points of contact (debumping)ExpiredOct 05, 01Jan 27, 09[B23K]
2008/0260,370 Optical SystemAbandonedDec 22, 04Oct 23, 08[G03B]
6955943 Method for producing a substrate arrangementExpiredJun 26, 02Oct 18, 05[H01L]
6915940 Device for applying solder globulesExpiredApr 12, 02Jul 12, 05[B23K]
2004/0135,265 Contacting microchips by means of pressureAbandonedFeb 10, 04Jul 15, 04[H01L]
2004/0069,758 Method and device for applying a solder to a substrateAbandonedAug 20, 03Apr 15, 04[B23K]
2004/0065,358 Treatment device for wafersAbandonedOct 16, 03Apr 08, 04[B08B]
2002/0040,923 Contact structure for connecting two substrates and also process for producing such a contact structureAbandonedDec 13, 01Apr 11, 02[B23K]
6153940 Core metal soldering knob flip-chip technologyExpiredAug 04, 97Nov 28, 00[H01L]

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