PACTECH - PACKAGING TECHNOLOGIES GMBH

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8431477 Method for joining aligned discrete optical elementsJan 08, 08Apr 30, 13[H01L]
6093971 Chip module with conductor paths on the chip bonding side of a chip carrierMay 02, 97Jul 25, 00[H01L]

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