PALOMAR TECHNOLOGIES, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 588
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
F27D DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE 124

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0363,356 Apparatus For Rapid Cooling Of Substrates Utilizing A Flat Plate And Cooling ChannelsJun 19, 17Dec 21, 17[F27D]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7845542 Monitoring deformation and time to logically constrain a bonding processSep 22, 05Dec 07, 10[B23K]
6776327 High-accuracy placement method utilizing double pick and placeNov 05, 02Aug 17, 04[B23K]
6622903 Production of a tailless ball bumpMar 27, 02Sep 23, 03[B23K]
6102275 Bond head having dual axes of motionJul 10, 98Aug 15, 00[B23K]
5603445 Ultrasonic wire bonder and transducer improvementsFeb 24, 94Feb 18, 97[B23K]
5148967 Apparatus and method for detecting missing interconnect materialJul 15, 91Sep 22, 92[H01L]
5121870 Method for reducing time to place a tool onto a workpieceApr 29, 91Jun 16, 92[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7068891 System and method for positioning optical fibersExpiredMay 29, 02Jun 27, 06[G02B]
6068171 Wire conveyance system having a contactless wire slacking deviceExpiredJul 10, 98May 30, 00[B65H]
5523956 Electrical interconnect integrity measuring methodExpiredOct 14, 94Jun 04, 96[B23K]
5459672 Electrical interconnect integrity measuring methodExpiredFeb 05, 93Oct 17, 95[B23K]
5364004 Wedge bump bonding apparatus and methodExpiredMay 10, 93Nov 15, 94[H01L]
5310948 Carbonylation of epoxidesExpiredJun 24, 93May 10, 94[C07D]
5091825 Orthogonal bonding method and equipmentExpiredApr 26, 89Feb 25, 92[H01R]
4998664 Bond signature analyzerExpiredDec 22, 89Mar 12, 91[H01L, B23K]
4912753 Robot axis controller employing feedback and open loop (feedforward) controlExpiredApr 04, 88Mar 27, 90[G06F]
4893742 Ultrasonic laser solderingExpiredDec 21, 88Jan 16, 90[B23K]
4893068 Digital servo employing switch mode lead/lag integratorExpiredNov 15, 88Jan 09, 90[G05B]
4817848 Compliant motion servoExpiredMay 12, 88Apr 04, 89[B23K]
4718591 Wire bonder with open center of motionExpiredDec 19, 86Jan 12, 88[B23K]
4600138 Bonding tool and clamp assembly and wire handling methodExpiredJul 25, 84Jul 15, 86[B23K]
4598853 Open-center flexural pivot wire bonding headExpiredMay 21, 84Jul 08, 86[B23K]

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