PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.
Patent Owner
Stats
- 28 US PATENTS IN FORCE
- 1 US APPLICATIONS PENDING
- Jan 23, 2018 most recent publication
Details
- 28 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 292 Total Citation Count
- Aug 31, 2009 Earliest Filing
- 9 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9877365 Light-emitting device for providing flash light sourceFeb 09, 17Jan 23, 18[H01L, H05B, H01Q]
9803846 Circuit substrate for carrying at least one light-emitting diode and light-emitting structure for providing illuminationJan 26, 15Oct 31, 17[F21V, F21S, H05K]
9698133 Method of manufacturing a multichip package structureJul 31, 15Jul 04, 17[F21V, H01L, F21Y, F21K, H05K]
9125328 Multichip package structure and method of manufacturing the sameMar 21, 12Sep 01, 15[F21V, H01L, H05K]
9078312 Multichip package structure for directly electrically connecting to an AC power sourceDec 09, 10Jul 07, 15[H01L, H05B, F21K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2013/0264,954 ENERGY-SAVING ILLUMINATION APPARATUS AND METHOD THEREOFAbandonedMay 19, 12Oct 10, 13[H05B]
2013/0106,290 ILLUMINATING APPARATUS CAPABLE OF MINIMIZING OCCURRENCE OF FLICKS AND METHOD USING THE SAMEAbandonedNov 01, 11May 02, 13[H05B]
2013/0026,507 MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAbandonedOct 03, 12Jan 31, 13[H01L]
2011/0101,389 MULTICHIP TYPE LED PACKAGE STRUCTURE FOR GENERATING LIGHT-EMITTING EFFECT SIMILAR TO CIRCLE SHAPE BY SINGLE WIRE OR DUAL WIRE BONDING METHOD ALTERNATIVELYAbandonedJan 14, 10May 05, 11[H01L]
2011/0089,441 MULTICHIP TYPE LED PACKAGE STRUCTURE FOR GENERATING LIGHT-EMITTING EFFECT SIMILAR TO CIRCLE SHAPEAbandonedJan 14, 10Apr 21, 11[H01L]
2011/0001,152 LED PACKAGE STRUCTURE FOR FORMING A STUFFED CONVEX LENS TO ADJUST LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAMEAbandonedSep 10, 09Jan 06, 11[H01L]
2010/0327,295 LED PACKAGE STRUCTURE WITH EXTERNAL CUTTING CHAMFER AND METHOD FOR MANUFACTURING THE SAMEAbandonedSep 01, 09Dec 30, 10[H01L]
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