PATENT BUSINESS DEVELOPMENT, LLC

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17 total patents issued
3 Total Apps Published
Aug 31, 2004 most recent publication

Details

17 Issued Patents
0 Issued in last 3 years
0 Published in last 3 years

337 Total Citation Count
Nov 20, 1996 Earliest Filing
1 Expired/Abandoned/Withdrawn Patents

Technologies

H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 12245

Subclasses

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F26B DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM 125

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G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS178

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G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1127

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H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1102

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Top Patents (by citation)

6,093,969 Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modulesMay 15, 99Jul 25, 00[H01L]59

6,392,304 Multi-chip memory apparatus and associated methodNov 12, 98May 21, 02[H01L]56

6,002,178 Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP)Nov 12, 97Dec 14, 99[H01L]44

6,249,052 Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configurationMay 18, 99Jun 19, 01[H01L]41

5,838,072 Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodesFeb 24, 97Nov 17, 98[H01L]40

6,301,121 Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing processApr 05, 99Oct 09, 01[H05K]29

6,369,451 Solder balls and columns with stratified underfills on substrate for flip chip joiningJan 12, 99Apr 09, 02[H01L]17

6,184,092 Self-aligned contact for trench DMOS transistorsNov 23, 99Feb 06, 01[H01L]11

6,677,668 Configuration for testing a substrate mounted with a most performance-demanding integrated circuitNov 28, 00Jan 13, 04[H01L]8

6,165,843 Covered slit isolation between integrated circuit devicesMar 20, 98Dec 26, 00[H01L]7

Recent Publications

2003/0101,615 Apparatus and method for preventing a wafer mapping system of an SMIF system from being polluted by corrosive gases remaining on wafersDec 05, 01Jun 05, 03[F26B]

2003/0014,197 Method and apparatus for wafer analysisJul 13, 01Jan 16, 03[G01B]

2001/0048,158 SOLDER BALLS AND COLUMNS WITH STRATIFIED UNDERFILLS ON SUBSTRATE FOR FLIP CHIP JOININGJan 12, 99Dec 06, 01[B23K, C22C]

Recent Patents

6,785,617 Method and apparatus for wafer analysisJul 13, 01Aug 31, 04[G01B]

6,677,668 Configuration for testing a substrate mounted with a most performance-demanding integrated circuitNov 28, 00Jan 13, 04[H01L]

6,588,123 Apparatus and method for preventing a wafer mapping system of an SMIF system from being polluted by corrosive gases remaining on wafersDec 05, 01Jul 08, 03[F26B]

6,392,304 Multi-chip memory apparatus and associated methodNov 12, 98May 21, 02[H01L]

6,369,451 Solder balls and columns with stratified underfills on substrate for flip chip joiningJan 12, 99Apr 09, 02[H01L]

6,301,121 Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing processApr 05, 99Oct 09, 01[H05K]

6,265,754 Covered slit isolation between integrated circuit devicesOct 13, 00Jul 24, 01[H01L]

6,249,052 Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configurationMay 18, 99Jun 19, 01[H01L]

6,204,677 Contact pressure jig for signal analysisSep 22, 98Mar 20, 01[G01R]

6,184,092 Self-aligned contact for trench DMOS transistorsNov 23, 99Feb 06, 01[H01L]

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