PECHINEY EMBALLAGE FLEXIBLE EUROPE
Patent Owner
Stats
- 36 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Nov 01, 2011 most recent publication
Details
- 36 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 6,736 Total Citation Count
- Apr 30, 1979 Earliest Filing
- 163 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
8048521 Multilayer heat sealant structures, packages and methods of making the sameOct 12, 07Nov 01, 11[B32B]
7041352 Thermoplastic structures for the storing and transporting of organoleptic sensitive productsJul 01, 03May 09, 06[B32B]
6709759 Thermoplastic film structures having improved barrier and mechanical propertiesApr 08, 02Mar 23, 04[B32B]
6403231 Thermoplastic film structures having improved barrier and mechanical propertiesMay 12, 00Jun 11, 02[B32B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2005/0058,793 Multilayer heat sealant structures, packages and methods of making the sameAbandonedSep 17, 03Mar 17, 05[F16L]
6846551 Multilayer film structures having improved seal and tear propertiesExpiredDec 22, 99Jan 25, 05[B32B]
6815057 Laminated thermoformable film structures useful for packaging food productsExpiredJun 05, 02Nov 09, 04[B32B]
2004/0131,805 Films having a desiccant material incorporated therein and methods of use and manufactureAbandonedMar 10, 03Jul 08, 04[F16L]
2003/0235,664 Films having a desiccant material incorporated therein and methods of use and manufactureAbandonedJun 20, 02Dec 25, 03[B65D]
2003/0231,811 Internally scored film, package and methods of making the sameAbandonedApr 24, 03Dec 18, 03[B65D]
6638463 Hybrid disk-cone extrusion die module having a spillover surface surrounded by a planar seal surfaceExpiredJul 27, 01Oct 28, 03[B29C]
6638464 Hybrid disk-cone extrusion die module having a spillover surface surrounding a planar seal surfaceExpiredJul 27, 01Oct 28, 03[B29C]
2003/0124,294 Scored package and a method of making the sameAbandonedDec 28, 01Jul 03, 03[G09F, B65B]
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