PHOENIX PRECISION TECHNOLOGY CORPORATION
Patent Owner
Stats
- 79 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Mar 10, 2011 most recent publication
Details
- 79 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 3,156 Total Citation Count
- Feb 28, 2001 Earliest Filing
- 125 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
7754538 Packaging substrate structure with electronic components embedded therein and method for manufacturing the sameAug 07, 08Jul 13, 10[H01L]
7719104 Circuit board structure with embedded semiconductor chip and method for fabricating the sameOct 05, 07May 18, 10[H01L]
7719853 Electrically connecting terminal structure of circuit board and manufacturing method thereofJul 20, 07May 18, 10[H05K]
7705446 Package structure having semiconductor chip embedded therein and method for fabricating the sameJul 24, 07Apr 27, 10[H01L]
7705471 Conductive bump structure of circuit board and method for forming the sameApr 27, 06Apr 27, 10[H01L]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2011/0056,738 PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOFAbandonedSep 04, 09Mar 10, 11[C25D, B23K, G03F, H05K]
2010/0089,612 Electrical connection element of packaging substrateAbandonedOct 15, 08Apr 15, 10[H01B]
2010/0029,047 METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR COMPONENTS EMBEDDED THEREINAbandonedJul 28, 09Feb 04, 10[H01L]
2010/0002,406 CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREINAbandonedJul 01, 09Jan 07, 10[H05K]
2009/0308,652 PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOFAbandonedJun 02, 09Dec 17, 09[H01R, H05K]
7626270 Coreless package substrate with conductive structuresExpiredOct 19, 06Dec 01, 09[H01L, H05K]
7598610 Plate structure having chip embedded therein and the manufacturing method of the sameExpiredJan 04, 07Oct 06, 09[H01L]
2009/0168,380 PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENTAbandonedDec 19, 08Jul 02, 09[H05K]
7546682 Methods for repairing circuit board having defective pre-soldering bumpExpiredNov 21, 06Jun 16, 09[H05K]
2009/0115,045 Stacked package module and method for fabricating the sameAbandonedOct 31, 08May 07, 09[H01L]
2009/0102,050 SOLDER BALL DISPOSING SURFACE STRUCTURE OF PACKAGE SUBSTRATEAbandonedOct 17, 07Apr 23, 09[H01L]
2009/0102,045 Packaging substrate having capacitor embedded thereinAbandonedOct 17, 08Apr 23, 09[H01L]
2009/0090,548 CIRCUIT BOARD AND FABRICATION METHOD THEREOFAbandonedOct 09, 08Apr 09, 09[H01R, H01B, H05K]
2009/0085,192 Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereofAbandonedOct 01, 08Apr 02, 09[H01L]
2009/0077,799 Circuit board structure with capacitor embedded therein and method for fabricating the sameAbandonedSep 12, 08Mar 26, 09[H05K]
2009/0071,699 PACKAGING SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEAbandonedOct 18, 07Mar 19, 09[H05K]
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