POINT ENGINEERING CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 31331
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 10196
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9147
 
  
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 7104
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 462
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2123
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
C09J ADHESIVES; ADHESIVE PROCESSES IN GENERAL 253
 
  
 
F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR 2108
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2203

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0073,999 MICRO SENSOR PACKAGE AND MANUFACTURING METHOD OF MICRO SENSOR PACKAGESep 12, 17Mar 15, 18[G01N, B01L, H05K]
2018/0074,033 MICRO SENSOR PACKAGESep 12, 17Mar 15, 18[G01N]
2018/0045,663 MICRO SENSORAug 10, 17Feb 15, 18[G01N]
2018/0003,661 MICRO MULTI-ARRAY SENSORJun 27, 17Jan 04, 18[G01N]
2018/0007,740 MICRO MULTI-ARRAY HEATER AND MICRO MULTI-ARRAY SENSORJun 27, 17Jan 04, 18[H05B, G01N]
2017/0338,383 METHOD FOR MANUFACTURING CHIP-MOUNTING SUBSTRATE, AND CHIP-MOUNTING SUBSTRATEMar 24, 17Nov 23, 17[H01L]
2017/0250,333 Substrate for Optical DeviceMay 12, 17Aug 31, 17[H01L]
2016/0370,336 Micro Heater and Micro SensorJun 14, 16Dec 22, 16[H05B, G01N]
2016/0126,414 Chip Substrate and Chip Package ModuleNov 03, 15May 05, 16[H01L]
2015/0049,447 Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the SameAug 15, 14Feb 19, 15[H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9913381 Base substrate which prevents burrs generated during the cutting process and method for manufacturing the sameAug 15, 14Mar 06, 18[H01L, H05K]
9865787 Chip substrate and chip package moduleNov 03, 15Jan 09, 18[H01L, H05K]
9847462 Array substrate for mounting chip and method for manufacturing the sameOct 28, 14Dec 19, 17[H01L]
9818913 Chip substrateJan 31, 17Nov 14, 17[H01L]
9773617 Folding type capacitor comprising through holeAug 13, 15Sep 26, 17[H01G]
9773618 CapacitorAug 21, 15Sep 26, 17[H01G]
9764949 Anodic oxide film structure cutting method and unit anodic oxide film structureSep 08, 16Sep 19, 17[H01L, B81C]
9768369 LED metal substrate package and method of manufacturing sameDec 28, 16Sep 19, 17[H01L]
9683711 Light emitting device substrate and method for manufacturing the sameOct 14, 14Jun 20, 17[F21V, H01L, F21Y, F21K]
9673367 Substrate for mounting chip and chip packageSep 17, 14Jun 06, 17[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0380,167 PRE-CUT SUBSTRATE AND UNIT CHIP SUBSTRATE COMPRISING HEMISPHERICAL CAVITYAbandonedJun 29, 15Dec 29, 16[H01L, H05K]
2015/0243,864 Method for Manufacturing Optical Device and Optical Device Manufactured by SameAbandonedAug 01, 13Aug 27, 15[H01L]
2015/0117,035 Heat Sink for Chip Mounting Substrate and Method for Manufacturing the SameAbandonedOct 10, 14Apr 30, 15[F21V]
2014/0225,135 Optical Device Array Substrate Having a Heat Dissipating Structure Integrated with a Substrate, and Method for Manufacturing SameAbandonedJul 26, 12Aug 14, 14[H01L]
2014/0177,242 Substrate for Optical DeviceAbandonedJul 11, 12Jun 26, 14[H01L]
2011/0278,624 SUBSTRATE FOR AN OPTICAL DEVICE, AN OPTICAL DEVICE PACKAGE COMPRISING THE SAME AND A PRODUCTION METHOD FOR THE SAMEAbandonedDec 29, 09Nov 17, 11[H01L]
2008/0169,468 Method and Apparatus For Fabricating Polycrystalline Silicon Film Using Transparent SubstrateAbandonedNov 14, 06Jul 17, 08[C23C, H01L]

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