PROMEX INDUSTRIES, INCORPORATED
Patent Owner
Stats
- 4 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Mar 10, 2016 most recent publication
Details
- 4 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 74 Total Citation Count
- Jun 06, 1995 Earliest Filing
- 1 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
8963341 Process for placing, securing and interconnecting electronic componentsOct 14, 08Feb 24, 15[H01L]
6884663 Method for reconstructing an integrated circuit package using lappingJan 07, 02Apr 26, 05[H01L]
6813828 Method for deconstructing an integrated circuit package using lappingJan 07, 02Nov 09, 04[H01R]
5700697 Method for packaging an integrated circuit using a reconstructed packageJun 06, 95Dec 23, 97[H01L]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2016/0073,512 Process for placing, securing and interconnecting electronic componentsAbandonedSep 05, 14Mar 10, 16[H05K]
Top Inventors for This Owner
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