QI DING TECHNOLOGY QINHUANGDAO CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 22340
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 20136
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0381,833 HEAT SINK, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAMEAug 25, 15Dec 29, 16[B23P, H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905508 Package structureAug 31, 17Feb 27, 18[H01L]
9855629 Heat sink, method for making the same, and electronic device having the sameAug 25, 15Jan 02, 18[H01L, B23P]
9786589 Method for manufacturing package structureSep 17, 15Oct 10, 17[H01L]
9735097 Package substrate, method for making the same, and package structure having the sameOct 31, 16Aug 15, 17[H01L]
9730328 Printed circuit board with embedded component and method for manufacturing sameDec 23, 13Aug 08, 17[H05K]
9548427 Package structure and method for manufacturing sameSep 24, 15Jan 17, 17[H01L]
9472426 Packaging substrate and method for manufacturing sameSep 01, 15Oct 18, 16[H01L]
9439281 Method for manufacturing printed circuit boardJul 22, 13Sep 06, 16[H05K]
9439282 Method for manufacturing printed circuit boardJul 24, 13Sep 06, 16[H01L, H05K]
9362248 Coreless package structure and method for manufacturing sameJul 15, 14Jun 07, 16[H01L, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0110,427 CHIP PACKAGE AND METHOD FOR MANUFACTURING SAMEAbandonedDec 11, 15Apr 20, 17[H01L]
2017/0084,509 SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAMEAbandonedNov 19, 15Mar 23, 17[H01L, H05K]
2016/0135,295 MULTI-LAYER CIRCUIT BOARDAbandonedDec 31, 15May 12, 16[H05K]

Top Inventors for This Owner

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