QORVO US, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 319142
 
  
 
H04B TRANSMISSION 28349
 
  
 
H03F AMPLIFIERS 2626
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 2076
 
  
 
H03G CONTROL OF AMPLIFICATION 818
 
  
 
H01Q AERIALS 7642
 
  
 
H04L TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION 69216
 
  
 
G05F SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES 4259
 
  
 
H03K PULSE TECHNIQUE 4289
 
  
 
H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 3963

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0076,810 DUAL-LEVEL POWER-ON RESET (POR) CIRCUITSep 14, 17Mar 15, 18[H03K]
2018/0048,280 ACOUSTIC RESONATOR DEVICE WITH CONTROLLED PLACEMENT OF FUNCTIONALIZATION MATERIALOct 26, 16Feb 15, 18[G01N, H03H]
2017/0294,892 FLUIDIC SENSOR DEVICE HAVING UV-BLOCKING COVERMar 27, 17Oct 12, 17[G01N, B01L, H03H]
2017/0288,629 SOLIDLY MOUNTED LAYER THIN FILM DEVICE WITH GROUNDING LAYERJun 15, 17Oct 05, 17[H01L, H03H]
2017/0278,623 COUPLED INDUCTOR STRUCTURESMar 23, 17Sep 28, 17[H01F]
2017/0255,578 ONE WIRE BUS TO RFFE TRANSLATION SYSTEMNov 30, 16Sep 07, 17[G06F]
2017/0227,497 BAW SENSING AND FILTRATION DEVICE AND RELATED METHODSFeb 02, 17Aug 10, 17[H01L, G01N]
2017/0207,766 CAP STRUCTURE FOR WAFER LEVEL PACKAGEDec 09, 16Jul 20, 17[H03H]
2017/0168,017 BAW SENSOR DEVICE WITH PEEL-RESISTANT WALL STRUCTUREDec 13, 16Jun 15, 17[H01L, G01N]
2017/0168,018 TEMPERATURE COMPENSATION AND OPERATIONAL CONFIGURATION FOR BULK ACOUSTIC WAVE RESONATOR DEVICESDec 15, 16Jun 15, 17[G01N, H03H]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922809 Deposition system for growth of inclined c-axis piezoelectric material structuresOct 13, 16Mar 20, 18[C23C, H01J, H01L]
9922847 Microelectronics package with inductive element and magnetically enhanced mold compound componentOct 06, 16Mar 20, 18[H01L]
9922898 Thermally enhanced semiconductor package with thermal additive and process for making the sameNov 16, 16Mar 20, 18[H01L]
9923088 Semiconductor device with vertically integrated pHEMTsAug 17, 16Mar 20, 18[H01L]
9917080 Semiconductor device with electrical overstress (EOS) protectionApr 26, 13Mar 13, 18[H01L]
9911678 Substrate with integrated heat spreaderOct 17, 16Mar 06, 18[H01L]
9911836 Vertical ballast technology for power HBT deviceFeb 27, 12Mar 06, 18[H01L]
9912296 High loop-gain pHEMT regulator for linear RF power amplifierMay 22, 17Mar 06, 18[H04B, H03F, H03G]
9912297 Envelope tracking power converter circuitryJun 28, 16Mar 06, 18[H04B, H03F]
9912307 Decoupling loop for reducing undesired magnetic coupling between inductors, and related methods and devicesMar 18, 16Mar 06, 18[H03F, H01F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0054,430 BAW RESONATOR HAVING MULTI-LAYER ELECTRODE AND BO RING CLOSE TO PIEZOELECTRIC LAYERAbandonedOct 07, 15Feb 23, 17[H03H]
2016/0343,604 SUBSTRATE STRUCTURE WITH EMBEDDED LAYER FOR POST-PROCESSING SILICON HANDLE ELIMINATIONAbandonedMar 30, 16Nov 24, 16[H01L]
9502328 Silicon-on-plastic semiconductor device and method of making the sameWithdrawnOct 31, 14Nov 22, 16[H01L]
9459645 Phase reconfigurable switching power supplyWithdrawnNov 30, 12Oct 04, 16[H02M, G05F]
9455357 Compound varactorWithdrawnSep 12, 14Sep 27, 16[H01L]
9450480 RF switching converter with ripple correctionWithdrawnOct 26, 12Sep 20, 16[H02M, G05F]
9450539 Communications based adjustments of an offset capacitive voltageWithdrawnJan 24, 14Sep 20, 16[H02M, H04B, H01Q, H03F]
9444407 Dual instantaneous envelope trackingWithdrawnApr 16, 14Sep 13, 16[H03F, H03G]
9423813 Phase reconfigurable switching power supplyWithdrawnNov 30, 12Aug 23, 16[H02M, G05F]
2016/0219,704 HERMETICALLY SEALED THROUGH VIAS (TVS)AbandonedJan 28, 16Jul 28, 16[H01L, H05K]
2015/0371,905 SOI WITH GOLD-DOPED HANDLE WAFERAbandonedJun 22, 15Dec 24, 15[H01L]
2015/0340,322 RF SWITCH STRUCTURE HAVING REDUCED OFF-STATE CAPACITANCEAbandonedMay 26, 15Nov 26, 15[H01L]
2015/0092,625 HYBRID ACTIVE AND PASSIVE TUNABLE RF FILTERSAbandonedNov 26, 14Apr 02, 15[H04L, H01P, H03H]
2014/0154,697 APPARATUS AND METHOD FOR MEASURING BINDING KINETICS WITH A RESONATING SENSORAbandonedApr 29, 13Jun 05, 14[G01N]
2014/0146,489 SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATESAbandonedMay 10, 13May 29, 14[H05K]
2014/0127,826 METHOD FOR MEASURING BINDING KINETICS WITH A RESONATING SENSORAbandonedApr 01, 13May 08, 14[G01N]
8670741 Mixer with high second-order and third-order intercept pointExpiredDec 21, 11Mar 11, 14[H04B]
8636912 Package for an electronic deviceExpiredFeb 20, 12Jan 28, 14[H01L, C23F]
8637898 Linear voltage-controlled current sourceExpiredJan 26, 11Jan 28, 14[H01L]
2014/0021,603 USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER OF A SEMICONDUCTOR DIEAbandonedJul 23, 13Jan 23, 14[H01L]

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