SALMON TECHNOLOGIES, LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR 159
 
  
 
G01M TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR166
 
  
 
G03G ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY 180

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7535107 Tiled construction of layered materialsOct 12, 05May 19, 09[H01L]
7505862 Apparatus and method for testing electronic systemsMay 29, 03Mar 17, 09[G01M]
7427809 Repairable three-dimensional semiconductor subsystemDec 16, 04Sep 23, 08[H01L]
7254024 Cooling apparatus and methodApr 08, 05Aug 07, 07[H05K]
5153617 Digitally controlled method and apparatus for delivering toners to substratesFeb 20, 91Oct 06, 92[G03G, G01D]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7586747 Scalable subsystem architecture having integrated cooling channelsExpiredJul 27, 06Sep 08, 09[H05K]
7415289 Apparatus and method for deploying an information retrieval systemExpiredSep 17, 03Aug 19, 08[H04M]
7408258 Interconnection circuit and electronic module utilizing sameExpiredFeb 20, 04Aug 05, 08[H01L]
2008/0036,842 Electronic printing pressAbandonedAug 09, 06Feb 14, 08[B41J]
2007/0023,889 Copper substrate with feedthroughs and interconnection circuitsAbandonedJul 27, 06Feb 01, 07[H01L]
2007/0023,904 Electro-optic interconnection apparatus and methodAbandonedJul 27, 06Feb 01, 07[H01L]
2007/0023,923 Flip chip interface including a mixed array of heat bumps and signal bumpsAbandonedJul 27, 06Feb 01, 07[H01L]
7163830 Method for temporarily engaging electronic component for testExpiredDec 07, 04Jan 16, 07[H01L]
2007/0007,983 Semiconductor wafer testerAbandonedJun 16, 06Jan 11, 07[G01R]
2005/0255,722 Micro blade assemblyAbandonedApr 08, 05Nov 17, 05[H01R]
2005/0184,376 System in packageAbandonedFeb 19, 04Aug 25, 05[H01L]
2003/0048,256 Computing device with roll up componentsAbandonedSep 06, 02Mar 13, 03[G09G]
6309049 Printing apparatus and method for imaging charged toner particles using direct writing methodsExpiredJan 29, 99Oct 30, 01[B41J]

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