SAMSUNG ELECTRO-MECHANICS CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology MATTERS Rank in Class
 
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 611 2
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 575 8
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 437 108
 
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 368 3
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 272 48
 
 
H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY 136 28
 
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 136 11
 
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 124 130
 
 
H02K DYNAMO-ELECTRIC MACHINES 106 32
 
 
H04B TRANSMISSION 96 117
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0067,277 CAMERA MODULE ACTUATOR Mar 02, 17 Mar 08, 18 [G02B, H02P, H02K]
2018/0068,775 MAGNETIC POWDER AND INDUCTOR CONTAINING THE SAME Jul 13, 17 Mar 08, 18 [H01F]
2018/0059,383 IMAGING LENS SYSTEM Feb 24, 17 Mar 01, 18 [G02B]
2018/0061,548 COMPOSITE FERRITE SHEET, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME Nov 02, 17 Mar 01, 18 [H01F, B05D, B32B, H05K, H02J]
2018/0061,552 THIN FILM TYPE COIL COMPONENT Mar 30, 17 Mar 01, 18 [H01F]
2018/0061,553 CHIP ELECTRONIC COMPONENT INCLUDING STRESS BUFFER LAYER Jun 21, 17 Mar 01, 18 [H01F]
2018/0061,555 INDUCTOR AND METHOD OF MANUFACTURING THE SAME Aug 15, 17 Mar 01, 18 [H01F]
2018/0061,561 INDUCTOR ARRAY COMPONENT AND BOARD FOR MOUNTING THE SAME Apr 11, 17 Mar 01, 18 [H01F]
2018/0061,573 THIN-FILM CAPACITOR Apr 05, 17 Mar 01, 18 [H01G]
2018/0061,807 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Mar 08, 17 Mar 01, 18 [H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9919917 Inertial sensor and method of manufacturing the same Oct 14, 14 Mar 20, 18 [C09K, G01P, G01C, B81C, B81B]
9921417 Optical image stabilizer and camera module including the same Jan 29, 16 Mar 20, 18 [G03B, G02B]
9921458 Camera module May 28, 15 Mar 20, 18 [H04N, G03B]
9922761 Magnetic material and device for transmitting data using the same May 16, 17 Mar 20, 18 [H01Q, H01F, H04B]
9922762 Composite electronic component and board having the same Mar 13, 15 Mar 20, 18 [H01G, H01F, H05K]
9923048 Monolayer thin film capacitor Sep 21, 16 Mar 20, 18 [H01L]
9923261 Mounting module and antenna apparatus Jan 11, 16 Mar 20, 18 [H01Q]
9923519 Power amplifier and phase correction method therefor Jan 11, 16 Mar 20, 18 [H03F]
9923554 Wireless power transmitter Jun 29, 16 Mar 20, 18 [H04J, H04L, H03F, H03K]
9923582 High-frequency signal predistortion device and nonlinear distortion correcting device for power amplifier Sep 14, 16 Mar 20, 18 [H04B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0155,320 VOLTAGE REGULATOR Abandoned Aug 09, 16 Jun 01, 17 [H02M]
2017/0101,307 SEMICONDUCTOR PACKAGE Abandoned Jun 14, 16 Apr 13, 17 [G01D, B81B, H01L]
2017/0094,786 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Abandoned Feb 24, 16 Mar 30, 17 [H05K]
2017/0084,528 PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF Abandoned Mar 18, 16 Mar 23, 17 [H01L]
2017/0086,290 PREPREG, PRINTED CIRCUIT BOARD INCLUDING PREPREG, AND METHOD OF FABRICATING THE SAME Abandoned Apr 14, 16 Mar 23, 17 [H05K]
2017/0086,299 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Abandoned Apr 06, 16 Mar 23, 17 [H01G, H05K]
2017/0062,115 COIL COMPONENT ASSEMBLY AND COIL COMPONENT Abandoned Mar 15, 16 Mar 02, 17 [H01F]
2017/0032,886 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Abandoned Mar 21, 16 Feb 02, 17 [H01F]
2017/0033,039 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Abandoned Mar 18, 16 Feb 02, 17 [H01L]
2017/0026,008 PROTECTION CIRCUIT OF POWER AMPLIFICATION CIRCUIT AND POWER AMPLIFICATION CIRCUIT USING THE SAME Abandoned Feb 24, 16 Jan 26, 17 [H03F]
2017/0018,513 SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHIN A SEALING ELEMENT Abandoned Sep 27, 16 Jan 19, 17 [H01L]
2017/0019,510 COVER FOR ELECTRONIC DEVICE, ANTENNA ASSEMBLY, ELECTRONIC DEVICE, AND METHOD FOR MANFUACTURING THE SAME Abandoned Sep 30, 16 Jan 19, 17 [H01Q, H04M, C25D]
2017/0019,989 CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME Abandoned Feb 23, 16 Jan 19, 17 [H05K]
2017/0008,806 DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME Abandoned Feb 18, 16 Jan 12, 17 [C04B, H01G]
2017/0005,032 LEAD FRAME AND STACK PACKAGE MODULE INCLUDING THE SAME Abandoned Jan 08, 16 Jan 05, 17 [H01L]
2017/0006,707 ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME Abandoned Mar 02, 16 Jan 05, 17 [H05K]
2016/0374,198 PRINTED CIRCUIT BOARD Abandoned Jan 21, 16 Dec 22, 16 [H05K]
2016/0360,609 CIRCUIT SUBSTRATE AND ELECTRONIC EQUIPMENT INCLUDING THE SAME Abandoned Mar 22, 16 Dec 08, 16 [H05K]
2016/0351,317 HYBRID INDUCTOR DEVICE Abandoned Feb 23, 16 Dec 01, 16 [H03H, H01F]
2016/0353,027 IMAGE CORRECTION CIRCUIT AND IMAGE CORRECTION METHOD Abandoned Mar 21, 16 Dec 01, 16 [H04N, G06T]

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