Sanyu Rec Co., Ltd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
  
 
A61H PHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY 135
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1119
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 1115
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 191
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0199,254 Method for Forming Resin Bodies and Formed ArticleJan 06, 16Jul 14, 16[A61H, B05C, B05D, C09D]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9666330 Polyurethane resin composition for electrical insulationSep 27, 12May 30, 17[C08G, H01B]
9373730 Method and apparatus for manufacturing optical deviceApr 19, 12Jun 21, 16[H01L]
8202933 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through pottingMar 10, 08Jun 19, 12[H01L, C08L]
7888189 Method for manufacturing electronic deviceSep 16, 08Feb 15, 11[H01L]
RE38961 Method for production of semiconductor packageMay 16, 02Jan 31, 06[H01L]
6579748 Fabrication method of an electronic componentMay 17, 00Jun 17, 03[H01L]
6063646 Method for production of semiconductor packageOct 06, 98May 16, 00[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
5232651 Method of sealing electric parts mounted on electric wiring board with resin compositionExpiredDec 10, 90Aug 03, 93[B29C]

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