SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 14348
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 10123
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 3444
 
  
 
H01C RESISTORS127
 
  
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 159

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8338713 Cabled signaling system and components thereofNov 14, 07Dec 25, 12[H05K]
7989929 Direct-connect signaling systemOct 31, 07Aug 02, 11[H01L]
7973391 Tapered dielectric and conductor structures and applications thereofMay 29, 08Jul 05, 11[H01L]
7966443 Memory systems including memory devices coupled together in a daisy-chained arrangementNov 01, 07Jun 21, 11[G06F]
7948093 Memory IC package assembly having stair step metal layer and aperturesDec 27, 07May 24, 11[H01L]
7845986 Torsionally-induced contact-force conductors for electrical connector systemsMay 06, 05Dec 07, 10[H01R]
7750446 IC package structures having separate circuit interconnection structures and assemblies constructed thereofJul 14, 05Jul 06, 10[H01L]
7732904 Multi-surface contact IC packaging structures and assembliesOct 12, 04Jun 08, 10[H01L]
7701323 Low profile discrete electronic components and applications of sameJun 01, 04Apr 20, 10[H01C]
7651336 High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufactureOct 08, 07Jan 26, 10[H01R, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7737545 Multi-surface IC packaging structures and methods for their manufactureExpiredFeb 13, 06Jun 15, 10[H01L]
2009/0091,017 Partitioned Integrated Circuit Package with Central Clock DriverAbandonedOct 09, 07Apr 09, 09[H01L]
7061096 Multi-surface IC packaging structures and methods for their manufactureExpiredSep 23, 04Jun 13, 06[H01L]

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