SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Patent Owner
Stats
- 33 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Dec 25, 2012 most recent publication
Details
- 33 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 1,261 Total Citation Count
- Mar 11, 2002 Earliest Filing
- 3 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
7973391 Tapered dielectric and conductor structures and applications thereofMay 29, 08Jul 05, 11[H01L]
7966443 Memory systems including memory devices coupled together in a daisy-chained arrangementNov 01, 07Jun 21, 11[G06F]
7948093 Memory IC package assembly having stair step metal layer and aperturesDec 27, 07May 24, 11[H01L]
7845986 Torsionally-induced contact-force conductors for electrical connector systemsMay 06, 05Dec 07, 10[H01R]
7750446 IC package structures having separate circuit interconnection structures and assemblies constructed thereofJul 14, 05Jul 06, 10[H01L]
7701323 Low profile discrete electronic components and applications of sameJun 01, 04Apr 20, 10[H01C]
7651336 High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufactureOct 08, 07Jan 26, 10[H01R, H05K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
7737545 Multi-surface IC packaging structures and methods for their manufactureExpiredFeb 13, 06Jun 15, 10[H01L]
2009/0091,017 Partitioned Integrated Circuit Package with Central Clock DriverAbandonedOct 09, 07Apr 09, 09[H01L]
7061096 Multi-surface IC packaging structures and methods for their manufactureExpiredSep 23, 04Jun 13, 06[H01L]
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