SEED LAYERS TECHNOLOGY LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 12350
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 497
 
  
 
H05H PLASMA TECHNIQUE 129

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2009/0239,372 Seed Layers for Electroplated InterconnectsMay 26, 09Sep 24, 09[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9673090 Seed layers for metallic interconnectsMay 26, 09Jun 06, 17[H01L]
8123861 Apparatus for making interconnect seed layers and productsMar 22, 10Feb 28, 12[C23C, H01L]
7682496 Apparatus for depositing seed layersMar 28, 06Mar 23, 10[C23C]
7550386 Advanced seed layers for interconnectsOct 05, 07Jun 23, 09[H01L]
7282445 Multiple seed layers for interconnectsJan 17, 07Oct 16, 07[H01L]
7199052 Seed layers for metallic interconnectsFeb 14, 05Apr 03, 07[H01L]
7105434 Advanced seed layery for metallic interconnectsDec 28, 04Sep 12, 06[H01L]
6924226 Methods for making multiple seed layers for metallic interconnectsDec 23, 02Aug 02, 05[H01L]
6903016 Combined conformal/non-conformal seed layers for metallic interconnectsAug 14, 03Jun 07, 05[C23C, H01L]
6610151 Seed layers for interconnects and methods and apparatus for their fabricationMay 03, 00Aug 26, 03[C23C, H01L, H05H]

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