SEMIQUEST, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 462
 
  
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 216
 
  
 
B23H WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL 120
 
  
 
B24D TOOLS FOR GRINDING, BUFFING, OR SHARPENING 129

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8292692 Polishing pad with endpoint window and systems and method using the sameNov 11, 09Oct 23, 12[B24B]
8177603 Polishing pad compositionApr 28, 09May 15, 12[B24B]
8075745 Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performanceOct 05, 05Dec 13, 11[C25F]
8066555 Polishing padAug 28, 08Nov 29, 11[B24D]
7846008 Method and apparatus for improved chemical mechanical planarization and CMP padApr 06, 07Dec 07, 10[B24B]
7815778 Electro-chemical mechanical planarization pad with uniform polish performanceNov 21, 06Oct 19, 10[B23H, C25F]
7530880 Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitorOct 05, 05May 12, 09[B24B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2009/0313,905 METHOD AND APPARATUS FOR ASSEMBLY OF CMP POLISHING PADSAbandonedJun 18, 08Dec 24, 09[B23P, B24D]
2009/0266,002 POLISHING PAD AND METHOD OF USEAbandonedApr 28, 09Oct 29, 09[B29C, B24D]
2009/0061,744 POLISHING PAD AND METHOD OF USEAbandonedAug 28, 07Mar 05, 09[B24B]
2009/0011,679 METHOD OF REMOVAL PROFILE MODULATION IN CMP PADSAbandonedJun 18, 08Jan 08, 09[B24B, B24D]
2008/0318,505 CHEMICAL MECHANICAL PLANARIZATION PAD AND METHOD OF USE THEREOFAbandonedJan 02, 08Dec 25, 08[B24D]

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