SENJU METAL INDUSTRY CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 14411
 
  
 
C22C ALLOYS 6121
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 37119
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 30332
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM19138
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 1735
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1091
 
  
 
F16C SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OF CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS 961
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 866
 
  
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 433

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0021,803 FLUID DISCHARGE DEVICE, FLUID DISCHARGE METHOD, AND FLUID APPLICATION DEVICEJan 13, 16Jan 25, 18[B05C, H01L, B05D, B23K, H05K]
2018/0015,572 Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder JointDec 24, 15Jan 18, 18[C23C, B23K, B22F, C22C]
2017/0355,042 Flux for Rapid Heating Method and Solder Paste for Rapid Heating MethodDec 21, 15Dec 14, 17[B23K]
2017/0348,805 SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENTDec 09, 15Dec 07, 17[B23K, C22C, H05K]
2017/0312,860 Solder Material, Solder Paste, Solder Preform, Solder Joint and Method of Managing the Solder MaterialNov 05, 14Nov 02, 17[C25D, B23K, B22F, C22C]
2017/0304,961 Solder Paste and Solder JointNov 06, 15Oct 26, 17[B23K, F16B]
2017/0287,862 Cu Column, Cu Core Column, Solder Joint, and Through-Silicon ViaSep 09, 14Oct 05, 17[H01L, B23K, B32B]
2017/0274,481 Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic ComponentSep 04, 15Sep 28, 17[B23K, C22C]
2017/0182,601 Flux-Coated Ball and Method of Manufacturing the SameDec 23, 16Jun 29, 17[C23C, B23K, H01B]
2017/0144,258 FLUX AND SOLDER PASTEFeb 07, 17May 25, 17[B23K]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9902022 Flux and solder pasteFeb 27, 15Feb 27, 18[B23K, C22C]
9849535 Jet nozzle and jet soldering apparatusSep 09, 16Dec 26, 17[B23K, H05K]
9844837 Lead-free solder alloyMar 23, 12Dec 19, 17[B23K, C22F, C22C]
9837757 Lead-free solder alloy and in-vehicle electronic circuitApr 03, 14Dec 05, 17[B23K, H01R, C22C]
9821397 Solder precoating method and workpiece for electronic equipmentDec 20, 04Nov 21, 17[B23K, B32B, H05K]
9816160 Ni ball, Ni nuclear ball, solder joint, foam solder and solder pasteSep 19, 13Nov 14, 17[B23K, B22F, C22F, C22C]
9808890 Solder alloyApr 17, 13Nov 07, 17[B23K, C22C]
9802251 Ni ball, Ni core ball, solder joint, solder paste, and solder foamFeb 04, 14Oct 31, 17[C25D, B23K, B22F, C22F, C22C]
9807889 Method of mounting electronic component to circuit boardJul 29, 13Oct 31, 17[H05K]
9796053 High-temperature lead-free solder alloyJul 29, 13Oct 24, 17[B23K, C22C, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0120,397 FLUXAbandonedDec 09, 16May 04, 17[B23K]
2015/0209,912 Cu CORE BALL, SOLDER PASTE AND SOLDER JOINTAbandonedJan 27, 15Jul 30, 15[H01L, B23K, H01B, C22C]
2015/0158,128 FLUX COMPOSITION, LIQUID FLUX, RESIN FLUX CORED SOLDER, AND SOLDER PASTEAbandonedJun 10, 13Jun 11, 15[B23K]
2015/0059,928 Flux and Solder PasteAbandonedApr 05, 12Mar 05, 15[B23K]
2015/0027,589 Solder PasteAbandonedDec 25, 12Jan 29, 15[B23K]
2014/0158,254 FluxAbandonedJun 04, 12Jun 12, 14[B23K]
2014/0137,988 FLUXAbandonedFeb 28, 12May 22, 14[B23K]
2014/0130,940 Solder PasteAbandonedJun 08, 12May 15, 14[B23K]
2013/0333,807 FLUXAbandonedFeb 28, 12Dec 19, 13[B23K]
2013/0333,806 FLUXAbandonedFeb 28, 12Dec 19, 13[B23K]
2012/0224,837 SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATHAbandonedApr 02, 12Sep 06, 12[F24H]
2012/0199,393 LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PARTAbandonedSep 02, 10Aug 09, 12[B23K, H01R, C22C]
2010/0291,399 LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTUREAbandonedSep 03, 07Nov 18, 10[B23K, B32B]
2010/0163,600 SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATHAbandonedDec 23, 09Jul 01, 10[B23K]
2010/0012,709 Reflow furnaceAbandonedDec 27, 04Jan 21, 10[B23K]
2009/0301,760 Method of Soldering a Module BoardAbandonedJun 13, 06Dec 10, 09[H05K]
2009/0236,013 Method for increasing the effectiveness of a component of a materialAbandonedMay 11, 09Sep 24, 09[B23K]
2009/0212,094 Wave Soldering BathAbandonedMar 13, 06Aug 27, 09[B23K]
2008/0246,164 Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic ComponentAbandonedMay 26, 05Oct 09, 08[H01L, B23K]
2007/0243,098 Lead-Free SolderAbandonedJul 29, 04Oct 18, 07[C22C]

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