SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 4155
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
B65H HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES178
 
  
 
B66C CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES 130
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1446
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132
 
  
 
H05F STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY 111

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5700045 Universal QFP tray transfer methodJul 09, 96Dec 23, 97[B66C]
5570033 Spring probe BGA (ball grid array) contactor with device stop and method thereforJul 20, 95Oct 29, 96[H01R, G01R]
5563509 Adaptable load board assembly for testing ICs with different power/ground bond pad and/or pin configurationsDec 19, 95Oct 08, 96[G01R]
5537031 Integrated circuit test jigJun 05, 95Jul 16, 96[H05F, G01R]
5491362 Package structure having accessible chipAug 13, 93Feb 13, 96[H01L]
5355320 System for controlling an integrated product process for semiconductor wafers and packagesMar 06, 92Oct 11, 94[G06F, G01R]
5268059 Detaping machine for removal of integrated circuit devices from sealed pocket tapeSep 02, 92Dec 07, 93[B65H]
5206794 Integrated circuit package with device and wire coat assemblyDec 20, 91Apr 27, 93[H05K]
5200809 Exposed die-attach heatsink packageSep 27, 91Apr 06, 93[H05K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7733657 Module base unit with strain relief meansExpiredJul 26, 05Jun 08, 10[H05K]
2008/0272,176 WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDINGAbandonedJul 11, 08Nov 06, 08[B23K]
6353261 Method and apparatus for reducing interconnect resistance using an interconnect wellExpiredMay 03, 99Mar 05, 02[H01L]
5687474 Method of assembling and cooling a package structure with accessible chipExpiredJan 11, 96Nov 18, 97[H05K]

Top Inventors for This Owner

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