SILEX MICROSYSTEMS AB

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 28334
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 627
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 626
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 4201
 
  
 
G01L MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE 353
 
  
 
A61B DIAGNOSIS; SURGERY; IDENTIFICATION 1239
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150
 
  
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 117
 
  
 
G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR 159

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9718674 Thin capping for MEMS devicesAug 26, 14Aug 01, 17[H01L, B81C, B81B]
9620390 Method of making a semiconductor device having a functional cappingJan 12, 16Apr 11, 17[H01L, B81B]
9613863 Method for forming electroless metal through viaFeb 10, 16Apr 04, 17[H01L]
9607915 Through substrate vias and deviceOct 31, 13Mar 28, 17[C25D, H01L, B81C, B81B]
9511999 Thin film cappingDec 17, 12Dec 06, 16[H01L, B81C, B81B]
9514985 Electroless metal through silicon viaSep 27, 13Dec 06, 16[H01L]
9507142 Precise definition of transducer electrodesJun 12, 13Nov 29, 16[H01L, B81C, G02B, B81B, G01D]
9484293 Semiconductor devices with close-packed via structures having in-plane routing and method of making sameOct 13, 15Nov 01, 16[H01L]
9448401 Via structure and method thereofNov 06, 13Sep 20, 16[H01L, G02B, B81B]
9362139 Method of making a semiconductor device having a functional cappingNov 19, 09Jun 07, 16[H01L, B81B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
9190356 Semiconductor devices with close-packed via structures having in-plane routing and method of making sameWithdrawnMar 12, 13Nov 17, 15[H01L]
2012/0288,422 GLASS MICRO FLUIDIC DEVICEAbandonedMay 11, 12Nov 15, 12[C03B, B81B, B32B]
2010/0053,922 MICROPACKAGING METHOD AND DEVICESAbandonedJan 25, 08Mar 04, 10[H01L, H01R]
2009/0302,414 TRENCH ISOLATION FOR REDUCED CROSS TALKAbandonedJan 25, 08Dec 10, 09[H01L]
2008/0308,884 Fabrication of Inlet and Outlet Connections for Microfluidic ChipsAbandonedOct 05, 06Dec 18, 08[H01L]

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