SILICONWARE PRECISION INDUSTRIES CO., INC.

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Patent Activity in the Last 10 Years

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7274088 Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereofJul 16, 02Sep 25, 07[H01L]
7019406 Thermally enhanced semiconductor packageAug 05, 03Mar 28, 06[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6429512 Ball grid array integrated circuit package with palladium coated heat-dissipation deviceExpiredMar 14, 00Aug 06, 02[H01L]

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