SILICONWARE PRECISION INDUSTRIES CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 492101
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6592
 
  
 
H01Q AERIALS 9101
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 7152
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 665
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 588
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 480
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 3122
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 330
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 3130

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0068,870 ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESep 06, 17Mar 08, 18[H01L]
2018/0068,983 ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMEApr 24, 17Mar 08, 18[H01L]
2017/0309,579 ELECTRONIC PACKAGE AND SUBSTRATE STRUCTUREApr 21, 17Oct 26, 17[H01L]
2017/0311,445 ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOFAug 03, 16Oct 26, 17[H05K]
2017/0077,047 ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOFDec 29, 15Mar 16, 17[H01L]
2017/0053,859 ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOFDec 29, 15Feb 23, 17[H01L]
2016/0300,660 ELECTRONIC DEVICEMay 21, 15Oct 13, 16[H01F]
2016/0172,762 ELECTRONIC MODULEApr 24, 15Jun 16, 16[H01Q]
2016/0163,632 PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAMEAug 04, 15Jun 09, 16[H01L]
2016/0155,559 ELECTRONIC PACKAGEApr 24, 15Jun 02, 16[H01L, H01F]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9903024 Substrate having electrical interconnection structures and fabrication method thereofApr 16, 15Feb 27, 18[H01L, C23F, H05K]
9905438 Method of manufacturing package substrate and semiconductor packageMar 22, 17Feb 27, 18[H01L]
9905546 Package on package structure and fabrication method thereofMar 14, 14Feb 27, 18[H01L]
9907161 Substrate structure and fabrication method thereofAug 23, 15Feb 27, 18[H05K]
9907186 Electronic package structure and method for fabricating the sameMay 30, 17Feb 27, 18[H01L, H05K]
9899235 Fabrication method of packaging substrateOct 14, 16Feb 20, 18[H01L, H05K]
9899237 Carrier, semiconductor package and fabrication method thereofFeb 07, 14Feb 20, 18[H01L]
9899249 Fabrication method of coreless packaging substrateOct 26, 16Feb 20, 18[H01L, H05K]
9899303 Electronic package and fabrication method thereofSep 23, 15Feb 20, 18[H01L]
9899308 Semiconductor package and method of fabricating the sameFeb 16, 17Feb 20, 18[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2018/0047,711 ELECTRONIC STACK STRUCTURE HAVING PASSIVE ELEMENTS AND METHOD FOR FABRICATING THE SAMEAbandonedNov 16, 16Feb 15, 18[H01L]
2017/0181,287 ELECTRONIC PACKAGEAbandonedMar 08, 16Jun 22, 17[H05K]
2016/0307,833 ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR FABRICATING ELECTRONIC PACKAGEAbandonedDec 28, 15Oct 20, 16[H01L]
2016/0240,302 SUBSTRATE STRUCTUREAbandonedDec 28, 15Aug 18, 16[H01F]
2016/0148,873 ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOFAbandonedAug 24, 15May 26, 16[H01L]
2016/0141,217 ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOFAbandonedApr 24, 15May 19, 16[H01L]
2016/0126,176 PACKAGE SUBSTRATE, PACKAGE STRUCTURE AND FABRICATION METHOD THEREOFAbandonedAug 27, 15May 05, 16[H01L]
2016/0118,323 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOFAbandonedAug 23, 15Apr 28, 16[H01L]
2016/0086,879 PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAMEAbandonedJul 22, 15Mar 24, 16[H01L]
2016/0086,903 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAMEAbandonedMar 30, 15Mar 24, 16[H01L]
2016/0081,186 SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAMEAbandonedJan 28, 15Mar 17, 16[H05K]
2016/0081,234 PACKAGE STRUCTUREAbandonedJan 28, 15Mar 17, 16[H05K]
2016/0049,359 INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOFAbandonedJun 19, 15Feb 18, 16[H01L]
2016/0013,123 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOFAbandonedDec 08, 14Jan 14, 16[H01L, H05K]
2015/0333,029 PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAMEAbandonedAug 14, 14Nov 19, 15[H01L]
2015/0325,516 CORELESS PACKAGING SUBSTRATE, POP STRUCTURE, AND METHODS FOR FABRICATING THE SAMEAbandonedAug 20, 14Nov 12, 15[H01L]
2015/0325,545 PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOFAbandonedApr 17, 15Nov 12, 15[H01L]
2015/0263,421 ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOFAbandonedMay 29, 14Sep 17, 15[H01Q]
2015/0235,914 FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION METHODS THEREOFAbandonedJul 10, 14Aug 20, 15[C25D, H01L, H05K]
2015/0179,597 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOFAbandonedFeb 19, 14Jun 25, 15[H01L]

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