SILTRONIC AG

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C30B SINGLE-CRYSTAL GROWTH 956
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 85278
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 4528
 
  
 
B28D WORKING STONE OR STONE-LIKE MATERIALS 169
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 1345
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 1024
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM7150
 
  
 
B23D PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR 425
 
  
 
C01B NON-METALLIC ELEMENTS; COMPOUNDS THEREOF475
 
  
 
C03C CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS456

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0233,293 A SEMICONDUCTOR WAFER AND A METHOD FOR PRODUCING THE SEMICONDUCTOR WAFERSep 11, 14Aug 11, 16[H01L]
2013/0192,628 CLEANING APPARATUS, EQUIPMENT, AND METHODSep 14, 12Aug 01, 13[B08B]
2013/0160,791 ULTRASONIC CLEANING METHODSep 14, 12Jun 27, 13[B08B]
2011/0223,841 METHOD FOR POLISHING A SEMICONDUCTOR WAFERMar 02, 11Sep 15, 11[B24B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9923050 Semiconductor wafer and a method for producing the semiconductor waferSep 11, 14Mar 20, 18[H01L, C30B]
9835567 Method for monitoring the operational state of a surface inspection system for detecting defects on the surface of semiconductor wafersJul 20, 15Dec 05, 17[G01N]
9828692 Apparatus and process for producing a single crystal of siliconMar 27, 15Nov 28, 17[C30B]
9828693 Apparatus and process for producing a crystal of semiconductor materialMay 14, 15Nov 28, 17[C30B]
9773688 Ultrasonic cleaning method and ultrasonic cleaning apparatusMay 10, 13Sep 26, 17[H01L, B08B]
9702055 Method for manufacturing single-crystal siliconJul 10, 12Jul 11, 17[C30B]
9691632 Epitaxial wafer and a method of manufacturing thereofDec 03, 13Jun 27, 17[H01L]
9670593 Method for recharging raw material polycrystalline siliconDec 19, 11Jun 06, 17[C30B]
9662687 Ultrasonic cleaning methodNov 03, 15May 30, 17[B08B]
9662804 Method for slicing wafers from a workpiece by means of a wire sawDec 02, 14May 30, 17[B28D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0294,883 METHOD FOR DRYING WAFER SUBSTRATES AND WAFER HOLDER FOR CONDUCTION OF THE METHODAbandonedApr 02, 15Oct 15, 15[H01L]
2014/0141,613 PROCESS FOR POLISHING A SEMICONDUCTOR WAFER, COMPRISING THE SIMULTANEOUS POLISHING OF A FRONT SIDE AND OF A REVERSE SIDE OF A SUBSTRATE WAFERAbandonedNov 19, 13May 22, 14[H01L]
8647173 Method for polishing a semiconductor waferExpiredMar 11, 13Feb 11, 14[B24B]
2013/0312,788 ULTRASONIC CLEANING METHOD AND ULTRASONIC CLEANING APPARATUSAbandonedMay 13, 13Nov 28, 13[H01L]
2013/0312,789 ULTRASONIC CLEANING METHOD AND ULTRASONIC CLEANING APPARATUSAbandonedMay 13, 13Nov 28, 13[H01L]
2013/0192,627 CLEANING METHODAbandonedSep 14, 12Aug 01, 13[B08B]
2013/0157,543 Polishing Pad and Method For Polishing A Semiconductor WaferAbandonedFeb 13, 13Jun 20, 13[B24B]
2013/0072,091 METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFERAbandonedSep 04, 12Mar 21, 13[B24B, H01L, B24D]
2013/0061,842 SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECEAbandonedAug 27, 12Mar 14, 13[H01L]
8395164 Multilayered semiconductor wafer and process for manufacturing the sameExpiredSep 06, 11Mar 12, 13[H01L]
8357549 Method for identifying an incorrect position of a semiconductor wafer during a thermal treatmentExpiredJan 25, 10Jan 22, 13[H01L]
2012/0315,428 Method For Producing Semiconductor Wafers Composed Of Silicon Having A Diameter Of At Least 450 mm, and Semiconductor Wafer Composed Of Silicon Having A Diameter of 450 mmAbandonedAug 22, 12Dec 13, 12[C01B]
2012/0270,407 SUSCEPTOR FOR SUPPORTING A SEMICONDUCTOR WAFER AND METHOD FOR DEPOSITING A LAYER ON A FRONT SIDE OF A SEMICONDUCTOR WAFERAbandonedMar 13, 12Oct 25, 12[C23C, H01L]
2012/0248,068 Process Module for the Inline-Treatment of SubstratesAbandonedJun 14, 10Oct 04, 12[B08B, B44C]
2012/0160,154 Method For Producing Silicon Single Crystal IngotAbandonedDec 19, 11Jun 28, 12[C30B]
8172941 Method and device for producing semiconductor wafers of siliconExpiredDec 19, 07May 08, 12[C30B]
8133318 Epitaxially coated silicon wafer with 110 orientation and method for producing itExpiredMay 26, 09Mar 13, 12[C30B]
2012/0032,229 Silicon Wafer And Production Method ThereofAbandonedJul 27, 11Feb 09, 12[H01L]
2012/0007,978 Method and Apparatus For Examining A Semiconductor WaferAbandonedJun 20, 11Jan 12, 12[H04N, G06K]
8043435 Cleaning liquid and cleaning method for electronic materialExpiredDec 19, 07Oct 25, 11[B08B]

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