SITIME CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 17345
 
  
 
H03B GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS 954
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 962
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 627
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 527
 
  
 
G01K MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR 442
 
  
 
H03L AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES 476
 
  
 
H02N ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR229
 
  
 
H04R LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS 2105
 
  
 
H03M CODING, DECODING OR CODE CONVERSION, IN GENERAL 1110

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9821998 Stacked-die MEMS resonator systemJun 20, 16Nov 21, 17[H01L, B81C, B81B]
9774313 Laterally-doped MEMS resonatorDec 12, 14Sep 26, 17[H02N, H03H]
9758371 Encapsulated microelectromechanical structureAug 19, 16Sep 12, 17[H01L, B81C, B81B]
9712128 Microelectromechanical resonatorJun 19, 16Jul 18, 17[H01L, H03H]
9705470 Temperature-engineered MEMS resonatorFeb 09, 15Jul 11, 17[H01L, H03H]
9695036 Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing sameFeb 04, 13Jul 04, 17[H01L, B81B, H03H]
9677948 MEMS device with micromachined thermistorApr 08, 15Jun 13, 17[G01K]
9667223 Resonator electrode shieldsNov 12, 15May 30, 17[H03H]
9548720 Temperature stable MEMS resonatorSep 23, 15Jan 17, 17[H01L, H03B, H03H]
9523615 Capacitor-referenced temperature sensingOct 30, 15Dec 20, 16[G01K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2008/0290,494 Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing sameAbandonedMay 21, 07Nov 27, 08[H01L]
2007/0257,728 Microelectromechanical multi-stage oscillatorAbandonedMay 03, 06Nov 08, 07[H03K]
2007/0170,528 Wafer encapsulated microelectromechanical structure and method of manufacturing sameAbandonedJan 20, 06Jul 26, 07[H01L]

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