SKORPIOS TECHNOLOGIES, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 39166
 
  
 
H01S DEVICES USING STIMULATED EMISSION3062
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 21341
 
  
 
H04B TRANSMISSION 12198
 
  
 
G02F DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS 10123
 
  
 
H04J MULTIPLEX COMMUNICATION 7118
 
  
 
H04L TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION 2283
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS198
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 177

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0067,343 ON-CHIP HIGH CAPACITANCE TERMINATION FOR TRANSMITTERSJul 21, 17Mar 08, 18[G02F, H03H]
2017/0229,840 BROADBAND BACK MIRROR FOR A III-V CHIP IN SILICON PHOTONICSFeb 07, 17Aug 10, 17[H01S]
2016/0246,016 INTEGRATED WAVEGUIDE COUPLERJan 14, 16Aug 25, 16[G02B, H01S]
2016/0111,407 METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALSSep 23, 15Apr 21, 16[H01L]
2015/0099,318 PROCESSING OF A DIRECT-BANDGAP CHIP AFTER BONDING TO A SILICON PHOTONIC DEVICEOct 08, 14Apr 09, 15[H01S]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922967 Multilevel template assisted wafer bondingSep 23, 15Mar 20, 18[H01L, G02B, H01S]
9923105 Processing of a direct-bandgap chip after bonding to a silicon photonic deviceOct 08, 14Mar 20, 18[H01L, H01S]
9917417 Method and system for widely tunable laserOct 04, 16Mar 13, 18[H01S]
9885832 Waveguide mode expander using amorphous siliconMay 27, 15Feb 06, 18[G02B]
9882073 Structures for bonding a direct-bandgap chip to a silicon photonic deviceOct 08, 14Jan 30, 18[H01L, H01S]
9829630 Tunable reflectors based on multi-cavity interferenceJul 22, 15Nov 28, 17[G02B, H01S, G02F]
9829631 Vertical output couplers for photonic devicesApr 20, 16Nov 28, 17[G02B]
9774164 Tunable laser with directional couplerDec 29, 15Sep 26, 17[G02B, H01S]
9709735 Method and system for heterogeneous substrate bonding for photonic integrationOct 12, 15Jul 18, 17[H01L, G02B, H01S]
9686015 Integrated optical network unitApr 11, 16Jun 20, 17[H04B, H04J]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0139,256 METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASERAbandonedSep 16, 14May 21, 15[H01S]
2013/0230,285 OPTICAL FIBER CONNECTION ARCHITECTUREAbandonedFeb 14, 13Sep 05, 13[G02B]

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