SPEEDFAM CO., LTD.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 462
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 3125
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0278,674 LOCAL DRY ETCHING APPARATUSMar 20, 17Sep 28, 17[H01J, H01L]
2016/0203,989 LOCAL DRY ETCHING APPARATUS AND LOCAL DRY ETCHING FABRICATION METHODSep 04, 14Jul 14, 16[H01J, H01L]
2016/0104,601 LOCAL DRY ETCHING APPARATUSOct 06, 15Apr 14, 16[H01J]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9358655 Outer periphery polishing apparatus for disc-shaped workpieceFeb 14, 13Jun 07, 16[B24B, H01L]
6300249 Polishing compound and a method for polishingApr 22, 99Oct 09, 01[H01L]
6210260 Carrier and CMP apparatusMar 01, 99Apr 03, 01[B24B]
6159082 Slurry circulation type surface polishing machineMar 02, 99Dec 12, 00[B24B]
6126531 Slurry recycling system of CMP apparatus and method of sameJan 21, 99Oct 03, 00[B24B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8114178 Polishing composition for semiconductor wafer and polishing methodExpiredApr 22, 08Feb 14, 12[C09K, C09C, B24D]
2010/0163,786 Polishing composition for semiconductor waferAbandonedDec 17, 09Jul 01, 10[C09K]
2009/0267,021 Colloidal silica for semiconductor wafer polishing and production method thereofAbandonedApr 10, 09Oct 29, 09[C09K]
2009/0253,813 Colloidal silica consisting of silica particles fixing nitrogen contained alkaline compoundAbandonedJan 30, 09Oct 08, 09[B01F]
2009/0223,136 Polishing compound for semiconductor wafer polishing and polishing methodAbandonedAug 28, 08Sep 10, 09[C09K]
2009/0203,300 Carrier for holding an object to be polishedAbandonedApr 14, 09Aug 13, 09[B24B, B24D]
2008/0237,535 Composition for polishing semiconductor wafer, and method of producing the sameAbandonedMar 17, 08Oct 02, 08[C09K]
2008/0038,996 POLISHING COMPOSITION FOR SEMICONDUCTOR WAFER, PRODUCTION METHOD THEREOF, AND POLISHING METHODAbandonedAug 13, 07Feb 14, 08[B24B, C09K]
7147541 Thickness control method and double side polisherExpiredFeb 23, 06Dec 12, 06[B24B]
7137867 Thickness control method and double side polisherExpiredFeb 23, 06Nov 21, 06[B24B]
7094355 Local dry etching methodExpiredJul 22, 03Aug 22, 06[H01L]
7005032 Wafer table for local dry etching apparatusExpiredMar 18, 02Feb 28, 06[H01L]
2005/0202,758 Carrier for holding an object to be polishedAbandonedMar 08, 05Sep 15, 05[B24B]
6908566 Local dry etching methodExpiredApr 21, 03Jun 21, 05[H01L]
6875701 Nanotopography removing methodExpiredFeb 05, 02Apr 05, 05[H01L]
6840841 Wafer edge polishing systemExpiredJan 13, 03Jan 11, 05[B24B]
6773335 Apparatus for polishing periphery of device wafer and polishing methodExpiredApr 04, 02Aug 10, 04[B24B]
2004/0063,329 Multi-step local dry etching method for SOI waferAbandonedSep 29, 03Apr 01, 04[H01L]
6649528 Local dry etching methodExpiredMay 15, 02Nov 18, 03[H01L]
6638147 Polishing method for removing corner material from a semi-conductor waferExpiredJun 05, 02Oct 28, 03[B24B]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.