STAKTEK GROUP L.P.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2445
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
 
 
G11C STATIC STORES 1150

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7768796 Die module systemJun 26, 08Aug 03, 10[H05K]
7759791 High density IC moduleApr 20, 07Jul 20, 10[H01L]
7760513 Modified core for circuit module system and methodApr 03, 06Jul 20, 10[H05K]
7719098 Stacked modules and methodOct 16, 07May 18, 10[H01L]
7626259 Heat sink for a high capacity thin module systemOct 24, 08Dec 01, 09[H01L, H05K]
7626273 Low profile stacking system and methodJan 20, 09Dec 01, 09[H01L]
7605454 Memory card and method for devisingFeb 01, 07Oct 20, 09[H01L]
5371866 Simulcast standard multichip memory addressing systemJun 01, 92Dec 06, 94[G06F, G11C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7737549 Circuit module with thermal casing systemsExpiredOct 31, 08Jun 15, 10[H01L, H05K]
2009/0298,230 Stacked Module Systems and MethodsAbandonedAug 10, 09Dec 03, 09[H01L]
2009/0073,661 THIN CIRCUIT MODULE AND METHODAbandonedSep 18, 07Mar 19, 09[H05K]
2008/0246,134 Package-Borne Selective Enablement StackingAbandonedApr 03, 07Oct 09, 08[H01L]
2008/0222,365 Managed Memory SystemAbandonedMar 08, 07Sep 11, 08[G06F]
2008/0211,077 Low profile chip scale stacking system and methodAbandonedMay 11, 06Sep 04, 08[H01L]
2008/0120,831 Stacked Modules and MethodAbandonedOct 16, 07May 29, 08[B23P, H01R]
2008/0088,032 Stacked Modules and MethodAbandonedOct 18, 07Apr 17, 08[H01L]
2008/0090,329 Stacked Modules and MethodAbandonedOct 18, 07Apr 17, 08[H01L]
2008/0079,132 Inverted CSP Stacking System and MethodAbandonedOct 29, 07Apr 03, 08[H01L]
2008/0067,662 Modularized Die Stacking System and MethodAbandonedNov 16, 07Mar 20, 08[H01L, H05K]
2008/0062,652 Vapor heat spreaderAbandonedSep 07, 06Mar 13, 08[H05K]
2007/0262,429 Perimeter stacking system and methodAbandonedMay 15, 06Nov 15, 07[H01L]
2007/0257,349 Leaded Package Integrated Circuit StackingAbandonedJul 09, 07Nov 08, 07[H01L]
2007/0164,416 Managed memory componentAbandonedJun 07, 06Jul 19, 07[H01L]
2007/0158,811 Low profile managed memory componentAbandonedAug 11, 06Jul 12, 07[H01L]
2007/0158,821 Managed memory componentAbandonedJul 07, 06Jul 12, 07[H01L]
2007/0126,124 Memory Module System and MethodAbandonedJan 29, 07Jun 07, 07[H01L]
2007/0126,125 Memory Module System and MethodAbandonedJan 29, 07Jun 07, 07[H01L]
2007/0114,649 Low Profile Stacking System and MethodAbandonedJan 23, 07May 24, 07[H01L]

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