SUMITOMO MITSUBISHI SILICON CORPORATION

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Technologies

Intl Class Technology # of Patents Rank
 
 
 
C30B SINGLE-CRYSTAL GROWTH 904
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 34235
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 745
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM7118
 
 
 
F27D DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE 77
 
 
 
B65D CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES 665
 
 
 
B01D SEPARATION 389
 
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 346
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 364
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 3135

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2010/0221,877 METHOD OF MANUFACTURING A SOI STRUCTURE HAVING A SIGE LAYER INTERPOSED BETWEEN THE SILICON AND THE INSULATORApr 13, 10Sep 02, 10[H01L]
2010/0178,753 SILICON WAFER AND METHOD FOR MANUFACTURING THE SAMEMar 22, 10Jul 15, 10[H01L]
2008/0047,934 SILICON WAFER ETCHING METHOD AND APPARATUS, AND IMPURITY ANALYSIS METHODApr 24, 07Feb 28, 08[C23F]
2007/0261,632 Apparatus for manufacturing silicon single crystal, method for manufacturing silicon single crystal, and silicon single crystalJul 13, 07Nov 15, 07[C30B]
2007/0087,299 HEAT TREATMENT JIG FOR SEMICONDUCTOR SILICON SUBSTRATEAug 11, 06Apr 19, 07[F27D]
2006/0249,479 Method for inspection, proces for making analytic piece, method for analysis, analyzer, process for producing soi wafer, and soi waferOct 16, 03Nov 09, 06[G01L]
2006/0246,723 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry compositionDec 25, 03Nov 02, 06[H01L]
2006/0154,837 Technique on ozone water for use in cleaning semiconductor substrateAug 11, 03Jul 13, 06[C23G, C11D]
2006/0130,737 Method for manufacturing silicon single crystalJul 07, 03Jun 22, 06[C30B]
2006/0130,738 Method for measuring point defect distribution of silicon single crystal ingotOct 17, 03Jun 22, 06[C30B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,283,252 Method of manufacturing semiconductor waferSep 14, 09Oct 09, 12[H01L]
8,252,404 High resistivity silicon wafersNov 12, 04Aug 28, 12[C30B]
8,002,610 Double side polishing method and apparatusNov 24, 09Aug 23, 11[B24B]
7,947,572 Method of manufacturing a SOI structure having a SiGe layer interposed between the silicon and the insulatorApr 13, 10May 24, 11[H01L]
7,837,791 Silicon single crystal wafer for particle monitorMay 23, 08Nov 23, 10[C30B]
7,824,493 Silicon wafer and method for manufacturing the sameJul 20, 05Nov 02, 10[C30B]
7,740,702 Silicon wafer and method for manufacturing the sameDec 22, 06Jun 22, 10[C30B]
7,741,193 SOI structure having a SiGe layer interposed between the silicon and the insulatorNov 10, 05Jun 22, 10[H01L]
7,686,973 Silicon wafer etching method and apparatus, and impurity analysis methodApr 24, 07Mar 30, 10[C23F]
7,678,200 Technique on ozone water for use in cleaning semiconductor substrateAug 11, 03Mar 16, 10[B08B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2006/0246,723 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry compositionDec 25, 03Nov 02, 06[H01L]
2005/0260,861 Method for evaluating semiconductor substrateMay 23, 05Nov 24, 05[G11B]
2005/0208,674 Method for analyzing impuritiesMar 16, 05Sep 22, 05[B08B]
2005/0016,896 Damper system for transportationMay 26, 04Jan 27, 05[B65D]
2005/0017,641 Lamp comprising a lamp body and line feed, which is guided along the exterior of the lamp body, and method for producing the lampAug 17, 04Jan 27, 05[H01J]
2005/0000,449 Susceptor for epitaxial growth and epitaxial growth methodJan 15, 04Jan 06, 05[C23C]
2004/0232,111 Method and apparatus for etching silicon wafer and method for analysis of impuritiesMar 11, 04Nov 25, 04[B44C]
2004/0187,769 Method of producing SOI waferMar 27, 03Sep 30, 04[C30B]
2004/0137,697 Method and apparatus for separating composite substrateJan 10, 03Jul 15, 04[H01L]
2004/0040,491 Silicon single crystal wafer for particle monitorJun 24, 03Mar 04, 04[C30B]
2003/0230,778 SOI structure having a SiGe Layer interposed between the silicon and the insulatorJan 30, 03Dec 18, 03[H01L]
2003/0140,843 Method for fabricating silicone single crystalNov 08, 02Jul 31, 03[C30B]
2003/0104,222 Silicon wafer and epitaxial silicon waferSep 18, 02Jun 05, 03[B32B]
2003/0051,658 Method and apparatus for controlling the oxygen concentration of a silicon single crystal, and method and apparatus for providing guidance for controlling the oxygen concentrationJul 23, 02Mar 20, 03[C30B]
2002/0142,170 Silicon single crystal, silicon wafer, and epitaxial waferJan 25, 02Oct 03, 02[B32B]
2002/0124,791 Silicon wafer and method for producing the sameMay 16, 00Sep 12, 02[C30B]
2002/0050,465 ContainerOct 22, 01May 02, 02[B65D]
2002/0029,738 Apparatus for pulling a single crystalMay 31, 01Mar 14, 02[C30B]
5,946,543 Semiconductor wafer evaluating method and semiconductor device manufacturing methodJan 16, 98Aug 31, 99[H01L]
5,152,867 Apparatus and method for producing silicon single crystalJul 19, 90Oct 06, 92[C30B]

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