Strasbaugh

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 4827
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2123
 
  
 
B24D TOOLS FOR GRINDING, BUFFING, OR SHARPENING 129
 
  
 
B25J MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES 157
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
B65H HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES178
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C30B SINGLE-CRYSTAL GROWTH 155
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS198

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2006/0205,322 Chemical-mechanical planarization tool force calibration method and systemMay 08, 06Sep 14, 06[B24B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9610669 Methods and systems for use in grind spindle alignmentSep 30, 13Apr 04, 17[B24B]
9457446 Methods and systems for use in grind shape control adaptationSep 30, 13Oct 04, 16[B24B]
9393669 Systems and methods of processing substratesJan 11, 13Jul 19, 16[B24B]
9193030 CMP retaining ring with soft retaining ring insertJun 03, 14Nov 24, 15[B24B]
9082713 Method of grinding wafer stacks to provide uniform residual silicon thicknessOct 27, 14Jul 14, 15[H01L]
8968052 Systems and methods of wafer grindingOct 19, 12Mar 03, 15[B24B]
8915771 Method and apparatus for cleaning grinding work chuck using a vacuumDec 27, 12Dec 23, 14[B24B]
8740673 CMP retaining ring with soft retaining ring insertOct 04, 11Jun 03, 14[B24B]
8565919 Method, apparatus and system for use in processing wafersNov 07, 11Oct 22, 13[G06F, B65H]
8520222 System and method for in situ monitoring of top wafer thickness in a stack of wafersNov 08, 11Aug 27, 13[G01B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0288,291 METHOD FOR GRINDING WAFERS BY SHAPING RESILIENT CHUCK COVERINGAbandonedMar 30, 15Oct 06, 16[B24B, H01L]
2014/0057,531 Method for grinding wafers by shaping resilient chuck coveringAbandonedAug 27, 12Feb 27, 14[B24B]
2013/0078,812 Wafer Carrier with Flexible Pressure PlateAbandonedSep 23, 11Mar 28, 13[B24B, H01L]
2012/0040,591 Replaceable cover for membrane carrierAbandonedAug 16, 10Feb 16, 12[B24B]
7551979 Robot calibration system and methodExpiredNov 17, 06Jun 23, 09[G06F]
2009/0061,734 Endpoint detection system for wafer polishingAbandonedMar 27, 07Mar 05, 09[B24B]
2007/0235,133 Devices and methods for measuring wafer characteristics during semiconductor wafer polishingAbandonedMar 29, 06Oct 11, 07[H01L, C23F]
2007/0105,491 Wafer Carrier Pivot MechanismAbandonedJan 02, 07May 10, 07[B24B]
2007/0032,170 Polishing pad with built-in optical sensorAbandonedJul 31, 06Feb 08, 07[B24B, B24D]
2007/0010,181 Independent edge control for CMP carriersAbandonedJun 19, 06Jan 11, 07[B24B]
6885206 Device for supporting thin semiconductor wafersExpiredFeb 11, 03Apr 26, 05[G01R]
6878037 Slurry pump control systemExpiredJul 22, 03Apr 12, 05[B24B]
6866564 Method of backgrinding wafers while leaving backgrinding tape on a chuckExpiredDec 10, 02Mar 15, 05[B24B]
6692339 Combined chemical mechanical planarization and cleaningExpiredNov 03, 00Feb 17, 04[B24B]
6629874 Feature height measurement during CMPExpiredOct 26, 00Oct 07, 03[B24B]
6602121 Pad support apparatus for chemical mechanical planarizationExpiredOct 20, 00Aug 05, 03[B24B]
6527621 Pad retrieval apparatus for chemical mechanical planarizationExpiredOct 20, 00Mar 04, 03[B24B]
6520843 High planarity chemical mechanical planarizationExpiredOct 26, 00Feb 18, 03[B24B]
6517419 Shaping polishing pad for small head chemical mechanical planarizationExpiredOct 26, 00Feb 11, 03[B24B]
6514121 Polishing chemical delivery for small head chemical mechanical planarizationExpiredOct 26, 00Feb 04, 03[B24B]

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