TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 62300
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 698
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 2204
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2157
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2445
 
  
 
B01D SEPARATION 1133
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 157
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 132
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 131

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0132,627 METHOD AND SYSTEM TO PREPARE, MANUFACTURE AND INSPECT MASK PATTERNS FOR A SEMICONDUCTOR DEVICENov 07, 14May 12, 16[G06F, G03F]
2015/0187,743 WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF FORMING SAMEDec 31, 13Jul 02, 15[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9870946 Wafer level package structure and method of forming sameDec 31, 13Jan 16, 18[H01L]
9841458 Method for de-embedding a device-under-testJan 23, 15Dec 12, 17[H01L, G01R]
9818744 Leakage current suppression methods and related structuresSep 04, 14Nov 14, 17[H01L]
9799582 Bump structure design for stress reductionApr 17, 17Oct 24, 17[H01L]
9734572 System and method for defect analysis of a substrateFeb 02, 15Aug 15, 17[G06T, G01N, G06K]
9735082 3DIC packaging with hot spot thermal management featuresDec 04, 13Aug 15, 17[H01L]
9735255 Method for fabricating a finFET device including a stem region of a fin elementJan 18, 13Aug 15, 17[H01L]
9722083 Source/drain junction formationOct 17, 13Aug 01, 17[H01L]
9691809 Backside illuminated image sensor device having an oxide film and method of forming an oxide film of a backside illuminated image sensor deviceJun 28, 13Jun 27, 17[H01L]
9601598 Method of manufacturing a fin-like field effect transistor (FinFET) deviceJul 30, 14Mar 21, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0320,451 SEMICONDUCTOR DEVICE HAVING NON-ORTHOGONAL ELEMENTAbandonedJun 01, 12Dec 05, 13[H01L]
2012/0082,940 PHOTOLITHOGRAPHY PROCESS FOR SEMICONDUCTOR DEVICEAbandonedDec 14, 11Apr 05, 12[H01L, G03B, G03F]
2010/0219,481 METHOD FOR MANUFACTURING A DUAL WORK FUNCTION SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE MADE THEREOFAbandonedJan 08, 10Sep 02, 10[H01L]
2009/0174,003 DUAL WORK FUNCTION DEVICE WITH STRESSOR LAYER AND METHOD FOR MANUFACTURING THE SAMEAbandonedNov 12, 08Jul 09, 09[H01L]
2008/0136,030 Semiconductor device comprising a doped metal comprising main electrodeAbandonedOct 23, 07Jun 12, 08[H01L]

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