TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Intl Class Technology MATTERS Rank in Class
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13082 1
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1246 61
 
 
G11C STATIC STORES 1011 11
 
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 787 4
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 367 15
 
 
H03K PULSE TECHNIQUE 311 17
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 172 3
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 168 14
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 165 61
 
 
H03L AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES 158 10
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0029,882 INTEGRATION SCHEME FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES AND COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) DEVICES Oct 04, 16 Feb 01, 18 [B81C, B81B]
2018/0031,492 SYSTEM AND METHOD FOR MEASUREMENT OF SEMICONDUCTOR DEVICE FABRICATION TOOL IMPLEMENT Jul 29, 16 Feb 01, 18 [G01N]
2018/0031,627 TIME TO CURRENT CONVERTER Jul 29, 16 Feb 01, 18 [G01R]
2018/0031,962 System and Method for Localized EUV Pellicle Glue Removal Jul 29, 16 Feb 01, 18 [B08B, G03F]
2018/0032,661 Systems and Methods for Generating a Multiple Patterning Lithography Compliant Integrated Circuit Layout Jul 28, 16 Feb 01, 18 [G06F]
2018/0033,471 MEMORY DEVICES WITH IMPROVED REFRESHING OPERATION Oct 09, 17 Feb 01, 18 [G11C]
2018/0033,611 CLUSTER TOOL AND MANUFACUTURING METHOD OF SEMICONDUCTOR STRUCTURE USING THE SAME Jul 26, 16 Feb 01, 18 [H01J, H01L]
2018/0033,626 Doping Through Diffusion and Epitaxy Profile Shaping Nov 01, 16 Feb 01, 18 [H01L]
2018/0033,682 ISOLATION REGIONS FOR SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME Aug 01, 16 Feb 01, 18 [H01L]
2018/0033,684 ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT Oct 06, 17 Feb 01, 18 [H01L]
2018/0033,686 METHOD FOR FORMING CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE Jul 29, 16 Feb 01, 18 [H01L]
2018/0033,687 STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE Jul 29, 16 Feb 01, 18 [H01L]
2018/0033,693 STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE Jul 29, 16 Feb 01, 18 [H01L]
2018/0033,695 Semiconductor Die Singulation and Structures Formed Thereby Dec 09, 16 Feb 01, 18 [H01L]
2018/0033,698 SEMICONDUCTOR DEVICE Oct 08, 17 Feb 01, 18 [H01L]
2018/0033,725 DUAL-MODE WIRELESS CHARGING DEVICE Jul 28, 16 Feb 01, 18 [H01L, H02J]
2018/0033,727 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Jul 26, 16 Feb 01, 18 [H01L]
2018/0033,730 SEMICONDUCTOR DEVICE STRUCTURE Oct 10, 17 Feb 01, 18 [H01L]
2018/0033,740 Dummy Fin Etch to Form Recesses in Substrate Jan 05, 17 Feb 01, 18 [H01L]
2018/0033,745 SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE AND METHOD OF FORMING THE SAME Jul 29, 16 Feb 01, 18 [H01L]
2018/0033,750 METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE Oct 06, 17 Feb 01, 18 [H01L]
2018/0033,756 METHOD FOR FORMING BUMP STRUCTURE Oct 05, 17 Feb 01, 18 [H01L]
2018/0033,770 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Jul 29, 16 Feb 01, 18 [H01L]
2018/0033,771 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME Oct 03, 16 Feb 01, 18 [H01L]
2018/0033,773 PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME Jul 29, 16 Feb 01, 18 [H01L]
2018/0033,776 STRUCTURES AND METHODS FOR PROVIDING ELECTRICAL ISOLATION IN SEMICONDUCTOR DEVICES Aug 01, 16 Feb 01, 18 [H01L]
2018/0033,782 USING METAL-CONTAINING LAYER TO REDUCE CARRIER SHOCK IN PACKAGE FORMATION Jul 29, 16 Feb 01, 18 [H01L]
2018/0033,796 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Jul 26, 16 Feb 01, 18 [H01L]
2018/0033,797 NON-VOLATILE MEMORY DEVICE HAVING NANOCRYSTAL FLOATING GATE AND METHOD OF FABRICATING SAME Jul 26, 16 Feb 01, 18 [H01L]
2018/0033,820 Semiconductor Image Sensor Device Having Back Side Illuminated Image Sensors with Embedded Color Filters Oct 09, 17 Feb 01, 18 [H01L]
2018/0033,866 Metal Gate and Contact Plug Design and Method Forming Same Feb 10, 17 Feb 01, 18 [H01L]
2018/0033,882 Silicon Germanium P-Channel FinFET Stressor Structure and Method of Making Same Oct 12, 17 Feb 01, 18 [H01L]
2018/0033,887 INTEGRATED CIRCUITS HAVING SOURCE/DRAIN STRUCTURE Oct 06, 17 Feb 01, 18 [H01L]
2018/0033,889 METHOD FOR FORMING STRESSOR, SEMICONDUCTOR DEVICE HAVING STRESSOR, AND METHOD FOR FORMING THE SAME Mar 09, 17 Feb 01, 18 [H01L]
2018/0022,603 MEMS DEVICES HAVING TETHERING STRUCTURES Jul 21, 16 Jan 25, 18 [B81C]
2018/0025,938 Method of Forming Trenches with Different Depths Oct 02, 17 Jan 25, 18 [H01L]
2018/0025,946 FINFET Channel on Oxide Structures and Related Methods Sep 25, 17 Jan 25, 18 [H01L]
2018/0025,966 INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME Jul 21, 16 Jan 25, 18 [H01L]
2018/0025,970 INTEGRATED CIRCUIT (IC) STRUCTURE FOR HIGH PERFORMANCE AND FUNCTIONAL DENSITY Jul 25, 16 Jan 25, 18 [H01L]
2018/0025,986 INTEGRATED FAN-OUT PACKAGE Jul 21, 16 Jan 25, 18 [H01L]
2018/0025,992 SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Dec 07, 16 Jan 25, 18 [H01L]
2018/0025,997 SEMICONDCUTOR STRUCTURE AND SEMICONDUCTOR MANUFACTURING PROCESS THEREOF Jul 20, 16 Jan 25, 18 [H01L]
2018/0025,999 INFO PACKAGE WITH INTEGRATED ANTENNAS OR INDUCTORS Oct 03, 16 Jan 25, 18 [H01L]
2018/0026,010 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Jul 21, 16 Jan 25, 18 [H01L]
2018/0026,029 Integrated ESD Protection Circuit for GaN Based Device Jul 21, 16 Jan 25, 18 [H01L]
2018/0026,031 Semiconductor Structure with Resistor Layer and Method for Forming the Same Sep 25, 17 Jan 25, 18 [H01L]
2018/0026,033 METHODS FOR FABRICATING FIN FIELD EFFECT TRANSISTORS Sep 17, 17 Jan 25, 18 [H01L]
2018/0026,034 SEMICONDUCTOR STRUCTURE WITH LOW DEFECT Sep 29, 17 Jan 25, 18 [H01L]
2018/0026,061 CIS STRUCTURE WITH COMPLEMENTARY METAL GRID AND DEEP TRENCH ISOLATION AND METHOD FOR MANUFACTURING THE SAME Sep 29, 17 Jan 25, 18 [H01L]
2018/0026,066 BACK-SIDE ILLUMINATED (BSI) IMAGE SENSOR WITH GLOBAL SHUTTER SCHEME Sep 20, 17 Jan 25, 18 [H01L]
2018/0026,067 COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) IMAGE SENSOR (CIS) PACKAGE WITH AN IMAGE BUFFER Jul 22, 16 Jan 25, 18 [H01L]
2018/0026,069 IMAGE SENSOR DEVICE AND METHOD OF FORMING SAME Sep 25, 17 Jan 25, 18 [H01L]
2018/0026,106 Enhancement Mode Field-Effect Transistor with a Gate Dielectric Layer Recessed on a Composite Barrier Layer for High Static Performance Jul 21, 16 Jan 25, 18 [H01L]
2018/0026,527 REGULATED VOLTAGE SYSTEMS AND METHODS USING INTRINSICALLY VARIED PROCESS CHARACTERISTICS Jul 25, 16 Jan 25, 18 [G01R, H02M]
2018/0026,530 CHARGE PUMP Sep 29, 17 Jan 25, 18 [H02M]
2018/0027,648 INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING THE SAME Oct 02, 17 Jan 25, 18 [H01L, H05K]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9878899 Method and apparatus for reducing in-process and in-use stiction for MEMS devices Oct 02, 15 Jan 30, 18 [B81C, B81B]
9880192 Method of manufacturing a motion sensor device Jan 29, 15 Jan 30, 18 [H01R, G01P, H01G]
9880201 Systems for probing semiconductor wafers Jan 21, 15 Jan 30, 18 [G01R]
9880220 Edge crack detection system Aug 23, 16 Jan 30, 18 [G01R, H01L, G06K]
9880460 Enhanced EUV lithography system Jul 15, 16 Jan 30, 18 [G03F]
9880575 Power converter and method of use Dec 05, 13 Jan 30, 18 [G05F]
9880596 Power management mechanism Jun 28, 12 Jan 30, 18 [G11B, G11C, G06F, H02M]
9881655 Memory circuit having data lines selectively coupled to a sense amplifier and method for operating the same Nov 02, 15 Jan 30, 18 [G11C]
9881794 Semiconductor methods and devices Nov 29, 16 Jan 30, 18 [H01L]
9881803 Chemical mechanical polishing method using slurry composition containing N-oxide compound Jul 21, 16 Jan 30, 18 [C09G, H01L]
9881816 Cleaning composition and method for semiconductor device fabrication Feb 01, 13 Jan 30, 18 [C23G, C11D, H01L]
9881821 Control wafer making device and method for measuring and monitoring control wafer Dec 30, 15 Jan 30, 18 [G01B, H01L]
9881834 Contact openings and methods forming same Mar 17, 17 Jan 30, 18 [H01L]
9881837 Fin-like field effect transistor (FinFET) based, metal-semiconductor alloy fuse device and method of manufacturing same Mar 03, 15 Jan 30, 18 [H01L]
9881840 Method of fabricating gate electrode using a treated hard mask Jun 09, 11 Jan 30, 18 [H01L]
9881850 Package structures and method of forming the same Sep 18, 15 Jan 30, 18 [H01L]
9881857 Pad design for reliability enhancement in packages Feb 04, 15 Jan 30, 18 [H01L]
9881870 Semiconductor device and manufacturing method thereof Jun 09, 16 Jan 30, 18 [G06F, H01L]
9881871 Schemes for forming barrier layers for copper in interconnect structures Aug 31, 15 Jan 30, 18 [H01L]
9881872 Method for fabricating a local interconnect in a semiconductor device Jan 15, 16 Jan 30, 18 [H01L]
9881884 Semiconductor device structure and method for forming the same Nov 05, 15 Jan 30, 18 [H01L]
9881885 Metal routing architecture for integrated circuits Nov 30, 15 Jan 30, 18 [H01L]
9881888 Manufacturing method of interconnect structure Mar 28, 16 Jan 30, 18 [H01L]
9881898 System in package process flow Sep 04, 12 Jan 30, 18 [H01L]
9881903 Package-on-package structure with epoxy flux residue Aug 04, 16 Jan 30, 18 [H01L]
9881908 Integrated fan-out package on package structure and methods of forming same Jan 15, 16 Jan 30, 18 [H01L]
9881918 Forming doped regions in semiconductor strips Sep 30, 16 Jan 30, 18 [H01L]
9881922 Semiconductor device and method Aug 01, 16 Jan 30, 18 [H01L]
9881949 Sensing device, image sensing system and method thereof Jun 17, 15 Jan 30, 18 [H04N, H01L]
9881952 Level shifter circuit and method May 04, 16 Jan 30, 18 [H01L]
9881993 Method of forming semiconductor structure with horizontal gate all around structure Jun 27, 14 Jan 30, 18 [H01L]
9882002 FinFET with an asymmetric source/drain structure and method of making same Jan 04, 16 Jan 30, 18 [H01L]
9882012 Junction gate field-effect transistor (JFET) having source/drain and gate isolation regions Jul 02, 14 Jan 30, 18 [H01L]
9882013 Semiconductor device and manufacturing method thereof Mar 31, 16 Jan 30, 18 [H01L]
9882017 Thin oxide formation by wet chemical oxidation of semiconductor surface when the one component of the oxide is water soluble Oct 01, 15 Jan 30, 18 [H01L]
9882023 Sidewall spacers for self-aligned contacts Feb 29, 16 Jan 30, 18 [H01L]
9882029 Semiconductor device including Fin-FET and manufacturing method thereof Jul 12, 16 Jan 30, 18 [H01L]
9882031 Method of manufacturing a horizontal gate-all-around transistor having a fin Jul 25, 16 Jan 30, 18 [H01L, B82Y]
9882032 Structure and method for FinFET device with buried sige oxide Jan 09, 17 Jan 30, 18 [H01L]
9882046 Ultra high voltage semiconductor device with electrostatic discharge capabilities Apr 08, 16 Jan 30, 18 [H01L]
9882553 Semiconductor device and circuit protecting method Sep 08, 16 Jan 30, 18 [H01L, H03K, H03L]
9883517 Uplink interference resolution in a wireless communication system Mar 17, 16 Jan 30, 18 [H04J, H04W]
9873100 Integrated circuit having temperature-sensing device May 15, 15 Jan 23, 18 [B01J, G01N]
9873610 Multiple bonding in wafer level packaging Jun 27, 13 Jan 23, 18 [G01P, B81C, B81B]
9873943 Apparatus and method for spatial atomic layer deposition Jun 01, 16 Jan 23, 18 [C23C, H01L]
9873944 Metal capping process and processing platform thereof Nov 01, 16 Jan 23, 18 [C23C, H01L]
9875388 Fingerprint sensor device and method May 09, 16 Jan 23, 18 [H01L, G06K]
9875774 Memory device and method of operating same Mar 16, 17 Jan 23, 18 [G11C]
9875789 3D structure for advanced SRAM design to avoid half-selected issue Nov 22, 13 Jan 23, 18 [G11C, H01L]
9875892 Method of forming a photoresist layer May 08, 15 Jan 23, 18 [B05D, H01L]
9875902 Semiconductor device and manufacturing method thereof Apr 12, 17 Jan 23, 18 [H01L]
9875906 Mechanisms for forming patterns using multiple lithography processes Mar 21, 16 Jan 23, 18 [H01L]
9875913 Method for singulating packaged integrated circuits and resulting structures Oct 30, 13 Jan 23, 18 [H01L]
9875942 Guard rings including semiconductor fins and regrown regions Dec 05, 16 Jan 23, 18 [H01L]
9875964 Semiconductor device components and methods Jan 28, 14 Jan 23, 18 [G01R, H01L]
9875967 Interconnect structure with air-gaps Mar 21, 17 Jan 23, 18 [H01L]
9875972 Semiconductor device structure and method for forming the same Jul 14, 16 Jan 23, 18 [H01L]
9875976 Switching device Dec 31, 15 Jan 23, 18 [H01L]
9875979 Conductive external connector structure and method of forming Nov 16, 15 Jan 23, 18 [H01L]
9875982 Semiconductor device and manufacturing method thereof Jun 01, 16 Jan 23, 18 [H01L]
9875989 Semiconductor device structure Jan 12, 16 Jan 23, 18 [H01L]
9876005 SCRS with checker board layouts Jun 02, 16 Jan 23, 18 [H01L]
9876008 Bandgap reference circuit Aug 13, 14 Jan 23, 18 [H01L]
9876021 Embedded HKMG non-volatile memory Dec 14, 15 Jan 23, 18 [H01L]
9876083 Semiconductor devices, FinFET devices and methods of forming the same Jan 29, 16 Jan 23, 18 [H01L]
9876086 Non-volatile memory device with floating gate having a tip corner Dec 13, 13 Jan 23, 18 [H01L]
9876088 III-V semiconductor layers, III-V semiconductor devices and methods of manufacturing thereof Nov 23, 16 Jan 23, 18 [H01L]
9876093 High electron mobility transistor and method of forming the same Jun 07, 16 Jan 23, 18 [H01L]
9876098 Method of forming a gate spacer Jan 15, 16 Jan 23, 18 [H01L]
9876108 Wrap around silicide for FinFETs Jul 27, 16 Jan 23, 18 [H01L]
9876112 Source/drain structure and manufacturing the same Jul 12, 16 Jan 23, 18 [H01L]
9876114 Structure and method for 3D FinFET metal gate Apr 15, 15 Jan 23, 18 [H01L]
9876115 FinFET isolation structure and method for fabricating the same Nov 06, 15 Jan 23, 18 [H01L]
9876117 Structure and formation method of semiconductor device structure Apr 04, 17 Jan 23, 18 [H01L]
9876127 Backside-illuminated photodetector structure and method of making the same Nov 22, 13 Jan 23, 18 [H01L]
9876167 High yield RRAM cell with optimized film scheme Jan 08, 15 Jan 23, 18 [H05B, H01L]
9876169 RRAM devices and methods Jun 12, 15 Jan 23, 18 [H01L]
9876184 Organic photosensitive device with an electron-blocking and hole-transport layer Aug 28, 13 Jan 23, 18 [H01L]
9876726 Systems and methods for prioritization of data for intelligent discard in a communication network Aug 01, 16 Jan 23, 18 [H04N, H04L, H04W]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0052,218 TESTING UNIT AND TESTING APPARATUS USING THE SAME ABAN Jan 07, 16 Feb 23, 17 [G01R]
2017/0033,012 METHOD FOR FABRICATING FIN OF FINFET OF SEMICONDUCTOR DEVICE ABAN Jul 31, 15 Feb 02, 17 [H01L]
2016/0260,704 High Voltage Device with a Parallel Resistor ABAN Mar 04, 15 Sep 08, 16 [H01L]
2016/0252,815 Photoresist with Floating-OOB-Absorption Additive ABAN Feb 26, 15 Sep 01, 16 [G03F, H01L]
2016/0240,623 VERTICAL GATE ALL AROUND (VGAA) DEVICES AND METHODS OF MANUFACTURING THE SAME ABAN Feb 13, 15 Aug 18, 16 [H01L]
2016/0240,775 SEMICONDUCTOR STRUCTURE WITH DATA STORAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME ABAN Oct 16, 15 Aug 18, 16 [H01L]
9406780 Semiconductor device and method Withdrawn Jan 09, 15 Aug 02, 16 [H01L]
9379093 Method and apparatus for image sensor packaging Withdrawn Apr 27, 12 Jun 28, 16 [H01L]
9379211 Fabricating method of semiconductor device Withdrawn Dec 07, 15 Jun 28, 16 [H01L]
9355885 Wafer support device Withdrawn Aug 23, 12 May 31, 16 [B23B, B05C, B05D, H01L]
2016/0091,916 Bandgap Circuits and Related Method ABAN Sep 30, 14 Mar 31, 16 [G05F]
2016/0077,544 CLOCK GATING CIRCUITS AND CIRCUIT ARRANGEMENTS INCLUDING CLOCK GATING CIRCUITS ABAN Sep 17, 14 Mar 17, 16 [G06F]
2016/0064,239 Method for Integrated Circuit Patterning ABAN Mar 11, 15 Mar 03, 16 [H01L]
2016/0035,667 Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices ABAN Jul 30, 14 Feb 04, 16 [H01L]
2016/0027,692 Method of Semiconductor Integrated Circuit Fabrication ABAN Oct 05, 15 Jan 28, 16 [H01L]
2015/0348,874 3DIC Interconnect Devices and Methods of Forming Same ABAN Aug 25, 14 Dec 03, 15 [H01L]
2015/0333,753 IO AND PVT CALIBRATION USING BULK INPUT TECHNIQUE ABAN May 16, 14 Nov 19, 15 [H03K]
2015/0318,292 Method of Forming an Embedded Memory Device ABAN Jul 14, 15 Nov 05, 15 [H01L]
2015/0318,367 Controlling Gate Formation for High Density Cell Layout ABAN Jun 26, 15 Nov 05, 15 [H01L]
2015/0306,737 CHEMICAL MECHANICAL POLISHING PAD ABAN Apr 23, 14 Oct 29, 15 [B24B, B24D]

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