TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Patent Owner

Follow Compare

Stats

Details

Technologies

Intl Class Technology # of Patents Rank
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5076 4
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 516 76
 
 
G11C STATIC STORES 381 18
 
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 289 9
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 139 30
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 102 6
 
 
H03K PULSE TECHNIQUE 97 41
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 85 7
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 74 10
 
 
G03C PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES 70 8
  • No Owners to Display

Top Patents (by citation)

Patent # Title Filing Date Issue Date Intl Class Cited #
5,568,629 Method for partitioning disk drives within a physical disk array and selectively assigning disk drive partitions into a logical disk array Nov 04, 93 Oct 22, 96 [G06F] 214
6,741,384 Control of MEMS and light modulator arrays Apr 30, 03 May 25, 04 [G02B] 209
6,861,277 Method of forming MEMS device Oct 02, 03 Mar 01, 05 [H01L] 206
6,143,604 Method for fabricating small-size two-step contacts for word-line strapping on dynamic random access memory (DRAM) Jun 04, 99 Nov 07, 00 [H01L] 193
5,354,695 Membrane dielectric isolation IC fabrication Apr 08, 92 Oct 11, 94 [H01L] 193
6,177,338 Two step barrier process Feb 08, 99 Jan 23, 01 [H01L] 187
5,943,581 Method of fabricating a buried reservoir capacitor structure for high-density dynamic random access memory (DRAM) circuits Nov 05, 97 Aug 24, 99 [H01L] 177
5,575,706 Chemical/mechanical planarization (CMP) apparatus and polish method Jan 11, 96 Nov 19, 96 [B24B] 171
6,008,126 Membrane dielectric isolation IC fabrication Feb 23, 98 Dec 28, 99 [H01L] 162
5,840,593 Membrane dielectric isolation IC fabrication Mar 10, 97 Nov 24, 98 [H04L] 155
  • No Patents to Display

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2013/0146,224 ADAPATIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL POLISHING Feb 04, 13 Jun 13, 13 [H01L]
2013/0146,647 Integrated Reflow and Cleaning Process and Apparatus for Performing the Same Dec 07, 11 Jun 13, 13 [B23K]
2013/0146,780 SYSTEMS AND METHODS PROVIDING ELECTRON BEAM WRITING TO A MEDIUM Feb 01, 13 Jun 13, 13 [H01J]
2013/0146,893 SIC CRYSTALLINE ON SI SUBSTRATES TO ALLOW INTEGRATION OF GAN AND SI ELECTRONICS Feb 06, 13 Jun 13, 13 [H01L]
2013/0146,895 PINCH-OFF CONTROL OF GATE EDGE DISLOCATION Dec 13, 11 Jun 13, 13 [H01L]
2013/0146,949 MECHANISMS FOR FORMING STRESSOR REGIONS IN A SEMICONDUCTOR DEVICE Dec 13, 11 Jun 13, 13 [H01L]
2013/0146,981 ANTENNA CELL DESIGN TO PREVENT PLASMA INDUCED GATE DIELECTRIC DAMAGE IN SEMICONDUCTOR INTEGRATED CIRCUITS Dec 12, 11 Jun 13, 13 [H01L]
2013/0146,987 Integrated Semiconductor Structure for SRAM and Fabrication Methods Thereof Dec 10, 12 Jun 13, 13 [H01L]
2013/0146,993 SEMICONDUCTOR STRUCTURE HAVING A POLYSILICON STRUCTURE AND METHOD OF FORMING SAME Dec 08, 11 Jun 13, 13 [H01L]
2013/0146,996 MAGNETIC DEVICE FABRICATION Dec 08, 11 Jun 13, 13 [H01L]
2013/0147,018 Structure for Reducing Integrated Circuit Corner Peeling Feb 11, 13 Jun 13, 13 [H01L]
2013/0147,023 INTEGRATED CIRCUIT GROUND SHIELDING STRUCTURE Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,030 Landing Areas of Bonding Structures Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,031 SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE ON POST-PASSIVATION INTERCONNCET Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,032 PASSIVATION LAYER FOR PACKAGED CHIP Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,033 POST-PASSIVATION INTERCONNECT STRUCTURE Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,034 BUMP STRUCTURE DESIGN FOR STRESS REDUCTION Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,046 Integrated Technology for Partial Air Gap Low K Deposition Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,049 Circuit Probing Structures and Methods for Probing the Same Dec 07, 11 Jun 13, 13 [H01L]
2013/0147,057 THROUGH SILICON VIA (TSV) ISOLATION STRUCTURES FOR NOISE REDUCTION IN 3D INTEGRATED CIRCUIT Dec 13, 11 Jun 13, 13 [H01L]
2013/0147,066 STRUCTURE AND METHOD FOR E-BEAM IN-CHIP OVERLAY MARK Dec 08, 11 Jun 13, 13 [H01L]
2013/0147,317 MEMS KINETIC ENERGY CONVERSION Feb 12, 13 Jun 13, 13 [H01L]
2013/0147,505 TEST PROBING STRUCTURE Dec 07, 11 Jun 13, 13 [G01R]
2013/0147,993 Apparatus and Method for Reducing Optical Cross-Talk in Image Sensors Dec 03, 12 Jun 13, 13 [H04N]
2013/0148,438 TRACKING CELL AND METHOD FOR SEMICONDUCTOR MEMORIES Dec 07, 11 Jun 13, 13 [G11C]
2013/0148,439 MEMORY CIRCUITS, SYSTEMS, AND OPERATING METHODS THEREOF Feb 05, 13 Jun 13, 13 [G11C]
2013/0149,807 Backside Illuminated CMOS Image Sensor Mar 09, 12 Jun 13, 13 [H01L]
2013/0149,821 Methods for a Gate Replacement Process Feb 01, 13 Jun 13, 13 [H01L]
2013/0149,826 FinFETs with Multiple Fin Heights Feb 11, 13 Jun 13, 13 [H01L]
2013/0149,856 Interface Structure for Copper-Copper Peeling Integrity Dec 27, 12 Jun 13, 13 [H01L]
2013/0149,871 CHEMICAL VAPOR DEPOSITION FILM PROFILE UNIFORMITY CONTROL Dec 07, 11 Jun 13, 13 [C23C, H01L]
2013/0150,997 METHOD AND SYSTEM FOR TOOL CONDITION MONITORING Dec 08, 11 Jun 13, 13 [G06F]
2013/0140,285 Laser Bonding for Stacking Semiconductor Substrates Feb 04, 13 Jun 06, 13 [B23K]
2013/0140,525 GALLIUM NITRIDE GROWTH METHOD ON SILICON SUBSTRATE Dec 01, 11 Jun 06, 13 [H01L]
2013/0140,563 Plating Process and Structure Dec 02, 11 Jun 06, 13 [H01L]
2013/0140,578 CIRCUIT STRUCTURE HAVING ISLANDS BETWEEN SOURCE AND DRAIN Dec 01, 11 Jun 06, 13 [H01L]
2013/0140,637 Fin-Like Field Effect Transistor (FinFET) Device and Method of Manufacturing Same Feb 01, 13 Jun 06, 13 [H01L]
2013/0140,639 HIGH GATE DENSITY DEVICES AND METHODS Dec 01, 11 Jun 06, 13 [H01L]
2013/0140,641 METAL GATE FEATURES OF SEMICONDUCTOR DIE Dec 06, 11 Jun 06, 13 [H01L]
2013/0140,643 INTEGRATED HIGH-K/METAL GATE IN CMOS PROCESS FLOW Feb 01, 13 Jun 06, 13 [H01L]
2013/0140,650 MEMS Devices and Methods for Forming the Same Dec 02, 11 Jun 06, 13 [H01L]
2013/0140,653 MEMS DEVICE ETCH STOP Feb 01, 13 Jun 06, 13 [H01L]
2013/0140,666 SELF-ALIGNED IMPLANTS TO REDUCE CROSS-TALK OF IMAGING SENSORS Jan 08, 13 Jun 06, 13 [H01L]
2013/0140,667 LOCALIZED CARRIER LIFETIME REDUCTION Dec 01, 11 Jun 06, 13 [H01L]
2013/0140,689 Bump-on-Trace Structures in Packaging Dec 02, 11 Jun 06, 13 [H01L]
2013/0140,690 TSV Structures and Methods for Forming the Same Dec 06, 11 Jun 06, 13 [H01L]
2013/0140,706 UBM Structures for Wafer Level Chip Scale Packaging Dec 06, 11 Jun 06, 13 [H01L]
2013/0140,713 Interposer Wafer Bonding Method and Apparatus Dec 01, 11 Jun 06, 13 [H01L]
2013/0140,715 Integrated Circuit Having Stress Tuning Layer and Methods of Manufacturing Same Dec 28, 12 Jun 06, 13 [H01L]
2013/0140,987 ION IMPLANTATION WITH CHARGE AND DIRECTION CONTROL Dec 01, 11 Jun 06, 13 [H01J]
2013/0141,145 CLOCK AND DATA RECOVERY CIRCUIT Dec 03, 12 Jun 06, 13 [H03L]
2013/0141,170 AMPLIFIER INDUCTOR SHARING FOR INDUCTIVE PEAKING Dec 06, 11 Jun 06, 13 [H03F]
2013/0141,260 PIPELINE ANALOG-TO-DIGITAL CONVERTER Dec 06, 11 Jun 06, 13 [H03M]
2013/0141,962 Methods and Apparatus for finFET SRAM Arrays in Integrated Circuits Dec 06, 11 Jun 06, 13 [G11C]
2013/0141,963 Methods and Apparatus for FinFET SRAM Cells Dec 06, 11 Jun 06, 13 [G11C, H01L]
2013/0142,594 Methods for Transporting Wafers Between Wafer Holders and Chambers Dec 01, 11 Jun 06, 13 [H01L]
2013/0143,361 Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices Dec 01, 11 Jun 06, 13 [H01L]
2013/0143,364 METHOD OF PROCESSING SOLDER BUMP BY VACUUM ANNEALING Dec 06, 11 Jun 06, 13 [H01L]
2013/0143,370 Logic Switch and Circuits Utilizing the Switch Dec 31, 12 Jun 06, 13 [H01L]
2013/0143,391 REACTED LAYER FOR IMPROVING THICKNESS UNIFORMITY OF STRAINED STRUCTURES Dec 01, 11 Jun 06, 13 [H01L]
2013/0143,406 TECHNIQUES PROVIDING PHOTORESIST REMOVAL Dec 06, 11 Jun 06, 13 [H01L]
2013/0143,410 Non-Uniformity Reduction in Semiconductor Planarization Feb 04, 13 Jun 06, 13 [H01L]
2013/0143,418 RAPID THERMAL ANNEALING TO REDUCE PATTERN EFFECT Jan 30, 13 Jun 06, 13 [H01L]
2013/0143,474 Slurry Sluppy System for CMP Process Dec 01, 11 Jun 06, 13 [B24B]
2013/0144,419 INTEGRATED CIRCUIT MANUFACTURING TOOL CONDITION MONITORING SYSTEM AND METHOD Dec 01, 11 Jun 06, 13 [G06F]
2013/0144,423 SYSTEMS AND METHODS OF AUTOMATIC BOUNDARY CONTROL FOR SEMICONDUCTOR PROCESSES Dec 06, 11 Jun 06, 13 [G06F]
2013/0133,688 WAFER DEBONDING AND CLEANING APPARATUS AND METHOD OF USE Nov 29, 11 May 30, 13 [B08B]
2013/0133,732 METHOD FOR FORMING INTERCONNECT IN SOLAR CELL Nov 30, 11 May 30, 13 [H01L]
2013/0134,435 HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE WITH IMPROVED BREAKDOWN VOLTAGE PERFORMANCE Oct 12, 12 May 30, 13 [H01L]
2013/0134,480 Formation of Devices by Epitaxial Layer Overgrowth Jan 09, 13 May 30, 13 [H01L]
2013/0134,481 Split-Channel Transistor and Methods for Forming the Same Nov 30, 11 May 30, 13 [H01L]
2013/0134,482 SUBSTRATE BREAKDOWN VOLTAGE IMPROVEMENT FOR GROUP III-NITRIDE ON A SILICON SUBSTRATE Oct 12, 12 May 30, 13 [H01L]
2013/0134,512 Power MOSFETs and Methods for Forming the Same Jan 11, 12 May 30, 13 [H01L]
2013/0134,522 Hybrid Fin Field-Effect Transistors May 04, 12 May 30, 13 [H01L]
2013/0134,541 Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same Mar 14, 12 May 30, 13 [H01L]
2013/0134,542 DARK CURRENT REDUCTION FOR BACK SIDE ILLUMINATED IMAGE SENSOR Nov 28, 11 May 30, 13 [H01L]
2013/0134,543 CMOS Image Sensor Big Via Bonding Pad Application for AICu Process Dec 27, 12 May 30, 13 [H01L]
2013/0134,553 INTERPOSER AND SEMICONDUCTOR PACKAGE WITH NOISE SUPPRESSION FEATURES Jan 30, 12 May 30, 13 [H01L]
2013/0134,559 Chip-on-Wafer Structures and Methods for Forming the Same Feb 15, 12 May 30, 13 [H01L]
2013/0134,563 Electrical Connection Structure Nov 30, 11 May 30, 13 [H01L]
2013/0134,581 PLANARIZED BUMPS FOR UNDERFILL CONTROL Nov 30, 11 May 30, 13 [H01L]
2013/0134,582 NOVEL BUMP STRUCTURES FOR MULTI-CHIP PACKAGING Mar 22, 12 May 30, 13 [H01L]
2013/0134,588 Package-On-Package (PoP) Structure and Method Feb 16, 12 May 30, 13 [H01L]
2013/0134,953 SPREAD SPECTRUM POWER CONVERTER Feb 27, 12 May 30, 13 [G05F]
2013/0135,011 PHASE FREQUENCY DETECTOR CIRCUIT Nov 30, 11 May 30, 13 [H03D, H03L]
2013/0135,018 PHASE-LOCKED LOOPS THAT SHARE A LOOP FILTER Feb 28, 12 May 30, 13 [H03L]
2013/0135,131 IDLE TONE SUPPRESSION CIRCUIT May 29, 12 May 30, 13 [H03M]
2013/0135,782 VARIABLE PRECISION THERMAL SENSOR Jul 11, 12 May 30, 13 [H02H]
2013/0135,784 Electrostatic Chuck Robotic System Nov 30, 11 May 30, 13 [H01L, B25J]
2013/0135,946 DUAL RAIL MEMORY ARCHITECTURE Jul 17, 12 May 30, 13 [G11C]
2013/0136,149 TEMPERATURE SENSOR WITH DIGITAL TRIM AND TRIMMING METHOD THEREOF Oct 25, 12 May 30, 13 [G01K]
2013/0136,873 APPARATUS AND METHOD WITH DEPOSITION CHAMBER HAVING MULTIPLE TARGETS AND MAGNETS Nov 30, 11 May 30, 13 [C23C, B05C]
2013/0137,034 METHOD OF PRE-TREATING A WAFER SURFACE BEFORE APPLYING A SOLVENT-CONTAINING MATERIAL THEREON Feb 03, 12 May 30, 13 [B08B, G03F]
2013/0137,222 Method for Stacking Semiconductor Dies Jan 23, 13 May 30, 13 [H01L]
2013/0137,236 Tunnel Field-Effect Transistor with Narrow Band-Gap Channel and Strong Gate Coupling Jan 14, 13 May 30, 13 [H01L]
2013/0137,238 METHOD FOR FORMING HIGH MOBILITY CHANNELS IN III-V FAMILY CHANNEL DEVICES Feb 28, 12 May 30, 13 [H01L]
2013/0137,251 Uniform Shallow Trench Isolation Regions and the Method of Forming the Same Nov 30, 11 May 30, 13 [H01L]
2013/0137,261 METHOD OF MODIFYING A LOW K DIELECTRIC LAYER HAVING ETCHED FEATURES AND THE RESULTING PRODUCT Nov 29, 11 May 30, 13 [H01L]
2013/0137,266 MANUFACTURING TECHNIQUES TO LIMIT DAMAGE ON WORKPIECE WITH VARYING TOPOGRAPHIES Nov 29, 11 May 30, 13 [H01L]
2013/0139,120 COMPUTER IMPLEMENTED SYSTEM AND METHOD FOR LEAKAGE CALCULATION Feb 23, 12 May 30, 13 [G06F]
2013/0139,121 RC Extraction Methodology for Floating Silicon Substrate with TSV Feb 06, 12 May 30, 13 [G06F]
2013/0126,591 Thermal Compress Bonding Jan 15, 13 May 23, 13 [H01L]
2013/0126,946 III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate Jan 14, 13 May 23, 13 [H01L]
2013/0126,950 Semiconductor Device and Method of Formation Nov 23, 11 May 23, 13 [H01L]
2013/0126,951 Method of Fabricating FinFET Device and Structure Thereof Jan 18, 13 May 23, 13 [H01L]
2013/0126,953 Methods and Apparatus for MOS Capacitors in Replacement Gate Process Nov 22, 11 May 23, 13 [H01L]
2013/0126,955 Methods and Apparatus for Hybrid MOS Capacitors in Replacement Gate Process Nov 22, 11 May 23, 13 [H01L]
2013/0126,977 N/P BOUNDARY EFFECT REDUCTION FOR METAL GATE TRANSISTORS Nov 17, 11 May 23, 13 [H01L]
2013/0126,979 INTEGRATED CIRCUITS WITH ELECTRICAL FUSES AND METHODS OF FORMING THE SAME Nov 22, 11 May 23, 13 [H01L]
2013/0126,981 MULTI-GATE SEMICONDUCTOR DEVICES Nov 22, 11 May 23, 13 [H01L]
2013/0126,982 EPITAXIAL PROCESS FOR FORMING SEMICONDUCTOR DEVICES Jan 18, 13 May 23, 13 [H01L]
2013/0126,985 (110) SURFACE ORIENTATION FOR REDUCING FERMI-LEVEL-PINNING BETWEEN HIGH-K DIELECTRIC AND GROUP III-V COMPOUND SEMICONDUCTOR SUBSTRATE Nov 18, 11 May 23, 13 [H01L]
2013/0126,989 Microstructure Device with an Improved Anchor Dec 20, 12 May 23, 13 [H01L]
2013/0127,016 METAL OXIDE METAL CAPACITOR WITH SLOT VIAS Jan 18, 13 May 23, 13 [H01L]
2013/0127,036 NOVEL MECHANISM FOR MEMS BUMP SIDE WALL ANGLE IMPROVEMENT Nov 23, 11 May 23, 13 [H01L]
2013/0127,040 DIE CARRIER FOR PACKAGE ON PACKAGE ASSEMBLY Nov 22, 11 May 23, 13 [B23K, H01L]
2013/0127,045 MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES Feb 27, 12 May 23, 13 [H01L]
2013/0127,049 Method for Stacking Devices and Structure Thereof Dec 17, 12 May 23, 13 [H01L]
2013/0127,052 Methods and Apparatus of Packaging Semiconductor Devices Nov 22, 11 May 23, 13 [H01L]
2013/0127,055 MECHANISMS OF FORMING DAMASCENE INTERCONNECT STRUCTURES Mar 29, 12 May 23, 13 [H01L]
2013/0127,059 Adjusting Sizes of Connectors of Package Components Nov 17, 11 May 23, 13 [G06F, H01L]
2013/0127,433 METHOD OF OPERATING VOLTAGE REGULATOR Jan 17, 13 May 23, 13 [G05F]
2013/0127,441 APPARATUS AND METHOD FOR ON-CHIP SAMPLING OF DYNAMIC IR VOLTAGE DROP Nov 18, 11 May 23, 13 [G01R]
2013/0127,508 SIGNAL DELAY CIRCUIT AND SIGNAL DELAY METHOD May 25, 12 May 23, 13 [H03H]
2013/0127,515 VOLTAGE DIVIDING CIRCUIT Nov 22, 11 May 23, 13 [H03L]
2013/0127,520 TRACKING CIRCUIT Nov 22, 11 May 23, 13 [H03K]
2013/0128,486 Forming Low Stress Joints Using Thermal Compress Bonding Dec 28, 12 May 23, 13 [B23K, H05K]
2013/0128,655 METHOD AND APPARATUS FOR DUAL RAIL SRAM LEVEL SHIFTER WITH LATCHING Nov 23, 11 May 23, 13 [G11C, H03L]
2013/0130,184 Apparatus and Method for Controlling Wafer Temperature Nov 21, 11 May 23, 13 [F27D]
2013/0130,410 METHOD FOR METAL CORRELATED VIA SPLIT FOR DOUBLE PATTERNING Jan 16, 13 May 23, 13 [H01L]
2013/0130,451 Semiconductor Device with Reliable High-Voltage Gate Oxide and Method of Manufacture Thereof Dec 21, 12 May 23, 13 [H01L]
2013/0130,456 INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF Dec 20, 12 May 23, 13 [H01L]
2013/0130,461 EPITAXIAL PROCESS FOR FORMING SEMICONDUCTOR DEVICES Jan 18, 13 May 23, 13 [H01L]
2013/0130,488 Method of Patterning a Metal Gate of Semiconductor Device Jan 18, 13 May 23, 13 [H01L]
2013/0130,496 SEMICONDUCTOR APPARATUS Jan 16, 13 May 23, 13 [H01L]
2013/0131,858 Auto Device Skew Manufacturing Jan 16, 13 May 23, 13 [G06F]
2013/0132,913 RECOGNITION OF TEMPLATE PATTERNS WITH MASK INFORMATION Nov 23, 11 May 23, 13 [G06F]
2013/0132,923 Method for Constant Power Density Scaling Jan 15, 13 May 23, 13 [G06F]

View all publication…

  • No Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,460,478 Wet processing apparatuses May 29, 07 Jun 11, 13 [B08B]
8,460,856 Material and method for photolithography Sep 21, 11 Jun 11, 13 [G03F]
8,460,979 Method of fabricating a backside illuminated image sensor Apr 19, 10 Jun 11, 13 [H01L]
8,461,015 STI structure and method of forming bottom void in same Apr 09, 10 Jun 11, 13 [H01L]
8,461,021 Multiple seal ring structure Dec 21, 12 Jun 11, 13 [H01L]
8,461,045 Bond pad connection to redistribution lines having tapered profiles Mar 17, 11 Jun 11, 13 [H01L]
8,461,621 Method and apparatus of forming bipolar transistor device Mar 09, 10 Jun 11, 13 [H01L]
8,461,629 Semiconductor device and method of fabricating same Jul 08, 11 Jun 11, 13 [H01L]
8,461,634 Divot engineering for enhanced device performance Apr 14, 11 Jun 11, 13 [H01L]
8,461,647 Semiconductor device having multi-thickness gate dielectric Mar 10, 10 Jun 11, 13 [H01L]
8,461,654 Spacer shape engineering for void-free gap-filling process Oct 11, 11 Jun 11, 13 [H01L]
8,462,510 Board-level package with tuned mass damping structure May 11, 11 Jun 11, 13 [H01R, H01L, H05K, F16F]
8,463,419 System and method for improved automated semiconductor wafer manufacturing Nov 12, 09 Jun 11, 13 [G06F]
8,464,186 Providing electron beam proximity effect correction by simulating write operations of polygonal shapes Jan 21, 11 Jun 11, 13 [G06F]
8,455,321 Multiple-gate transistors with reverse T-shaped fins Nov 11, 11 Jun 04, 13 [H01L]
8,455,354 Layouts of POLY cut openings overlapping active regions Apr 06, 11 Jun 04, 13 [H01L]
8,455,357 Method of plating through wafer vias in a wafer for 3D packaging Sep 28, 09 Jun 04, 13 [H01L]
8,455,859 Strained structure of semiconductor device Oct 01, 09 Jun 04, 13 [H01L]
8,455,860 Reducing source/drain resistance of III-V based transistors Nov 10, 09 Jun 04, 13 [H01L]
8,455,883 Stressed semiconductor device and method of manufacturing May 19, 11 Jun 04, 13 [H01L]
8,455,929 Formation of III-V based devices on semiconductor substrates Jun 30, 10 Jun 04, 13 [H01L]
8,455,930 Strained semiconductor device with facets Jan 05, 11 Jun 04, 13 [H01L]
8,455,952 Spacer elements for semiconductor device Nov 22, 10 Jun 04, 13 [H01L]
8,455,971 Apparatus and method for improving charge transfer in backside illuminated image sensor Feb 14, 11 Jun 04, 13 [H01L]
8,455,982 Overlay mark enhancement feature Feb 29, 12 Jun 04, 13 [H01L]
8,455,995 TSVs with different sizes in interposers for bonding dies Apr 16, 10 Jun 04, 13 [H01L]
8,455,999 Method for reducing chip warpage Sep 22, 11 Jun 04, 13 [H01L]
8,456,008 Structure and process for the formation of TSVs Sep 15, 11 Jun 04, 13 [H01L]
8,456,009 Semiconductor structure having an air-gap region and a method of manufacturing the same Feb 18, 10 Jun 04, 13 [H01L]
8,456,207 Lock detector and method of detecting lock status for phase lock loop Nov 16, 11 Jun 04, 13 [H03L]
8,456,942 Regulators regulating charge pump and memory circuits thereof Jun 27, 12 Jun 04, 13 [G11C]
8,458,631 Cycle time reduction in data preparation Aug 11, 11 Jun 04, 13 [G06F]
8,450,052 Double patterning strategy for contact hole and trench in photolithography Oct 17, 11 May 28, 13 [G03F]
8,450,126 Semiconductor test pad structures Aug 03, 11 May 28, 13 [G01R, H01L]
8,450,161 Method of fabricating a sealing structure for high-k metal gate May 07, 12 May 28, 13 [H01L]
8,450,200 Method for stacked contact with low aspect ratio Dec 20, 10 May 28, 13 [H01L]
8,450,216 Contact etch stop layers of a field effect transistor Aug 03, 10 May 28, 13 [H01L]
8,450,672 CMOS image sensors formed of logic bipolar transistors Mar 31, 10 May 28, 13 [H01L]
8,450,722 Magnetoresistive random access memory and method of making the same Jul 15, 11 May 28, 13 [H01L]
8,450,778 Method and apparatus for memory cell layout Aug 24, 10 May 28, 13 [H01L]
8,450,808 HVMOS devices and methods for forming the same Jan 16, 12 May 28, 13 [H01L]
8,450,827 MOS varactor structure and methods Jan 25, 11 May 28, 13 [H01L]
8,450,834 Spacer structure of a field effect transistor with an oxygen-containing layer between two oxygen-sealing layers Feb 16, 10 May 28, 13 [H01L]
8,450,990 Dynamic control loop for switching regulators Aug 16, 10 May 28, 13 [G05F]
8,451,033 Millimeter-wave wideband frequency doubler Dec 14, 10 May 28, 13 [H03B]
8,451,072 Method for transmission lines using meta-materials Jan 24, 08 May 28, 13 [H03H, H04B]
8,451,655 MRAM cells and circuit for programming the same Feb 02, 12 May 28, 13 [G11C]
8,451,669 Multi-power domain design Apr 10, 12 May 28, 13 [G11C]
8,451,671 Multiplexing circuit for high-speed, low leakage, column-multiplexing memory devices Oct 15, 10 May 28, 13 [G11C]
8,452,439 Device performance parmeter tuning method and system Mar 15, 11 May 28, 13 [G21C, G06F, G01N]
8,453,043 Built-in bit error rate test circuit Sep 13, 10 May 28, 13 [G06F, H03M]
8,453,095 Systems and methods for creating frequency-dependent netlist Jul 06, 11 May 28, 13 [G06F]
8,445,296 Apparatus and methods for end point determination in reactive ion etching Jul 22, 11 May 21, 13 [H01L]
8,445,340 Sacrificial offset protection film for a FinFET device Nov 19, 09 May 21, 13 [H01L]
8,445,380 Semiconductor having a high aspect ratio via May 25, 12 May 21, 13 [H01L]
8,445,940 Source and drain feature profile for improving device performance Jul 09, 12 May 21, 13 [H01L]
8,445,953 Structure for flash memory cells Apr 22, 10 May 21, 13 [H01L]
8,445,955 Quasi-vertical structure for high voltage MOS device Feb 03, 10 May 21, 13 [H01L]
8,445,970 Bipolar device compatible with CMOS process technology Sep 16, 11 May 21, 13 [H01L]
8,446,007 Non-uniform alignment of wafer bumps with substrate solders May 20, 10 May 21, 13 [H01L]
8,446,012 Interconnect structures May 11, 07 May 21, 13 [H01L]
8,446,161 Method of self monitoring and self repair for a semiconductor IC Nov 24, 09 May 21, 13 [G01R]
8,448,100 Tool and method for eliminating multi-patterning conflicts Apr 11, 12 May 21, 13 [G06F]
8,448,120 RC extraction for single patterning spacer technique May 09, 11 May 21, 13 [G06F]

View all Patent…

  • No Patents to Display

Top Inventors for This Owner

Inventor Name Address Patent #
Yu Chen-Hua
Hsin-Chu, TW
614
Jang Syun-Ming
Hsin-Chu, TW
321
Liang Mong-Song
Hsin-Chu, TW
220
Liu Chung-Shi
Hsin Chu, TW
215
Tsai Chia-Shiung
Hsin-Chu, TW
206
Yaung Dun-Nian
Taipei, TW
189
Shue Shau-Lin
Hsinchu, TW
182
Tao Hun-Jan
Hsinchu, TW
182
Thei Kong-Beng
Hsin-Chu, TW
176
Chuang Harry
Austin, US
173
  • No Inventor to Display