TAIYO INK MFG. CO., LTD.
Patent Owner
Stats
- 53 US PATENTS IN FORCE
- 4 US APPLICATIONS PENDING
- Feb 13, 2018 most recent publication
Details
- 53 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 967 Total Citation Count
- Jun 06, 1988 Earliest Filing
- 49 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2017/0048,974 RESIN COMPOSITION FOR PERMANENT INSULATING FILM, PERMANENT INSULATING FILM, MULTILAYER PRINTED WIRING BOARD, AND PROCESS FOR PRODUCING THE SAMEMar 19, 15Feb 16, 17[H05K]
2016/0360,621 THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED FOR SAMEJan 14, 15Dec 08, 16[H05K]
2016/0215,084 CURABLE COMPOSITION FOR PRINTED CIRCUIT BOARD, AND CURED COATING FILM AND PRINTED CIRCUIT BOARD INCORPORATING SAMESep 30, 14Jul 28, 16[C08F, C09D, H05K]
2015/0090,482 CURABLE COMPOSITION FOR PRINTED CIRCUIT BOARD, CURED COATING FILM USING THE SAME, AND PRINTED CIRCUIT BOARDSep 30, 14Apr 02, 15[C09D, H05K]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9891523 Photosensitive dry film and process for producing printed wiring board using the sameJun 29, 15Feb 13, 18[G03F, H05K]
9796810 Heat-curable composition, dry film, and printed wiring boardJun 27, 14Oct 24, 17[C08G, B32B, H05K]
9596754 Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrateDec 18, 12Mar 14, 17[H01L, G06F, G03F, H05K, B32B]
9497856 Laminated structure, dry film and method of producing laminated structureMar 29, 13Nov 15, 16[G03F, B32B, H05K]
9388308 Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the sameSep 26, 13Jul 12, 16[C08J, C08L, H05K]
9310680 Photocurable/thermosetting resin compositionJun 15, 12Apr 12, 16[C08F, G03F, C08L, B32B, H05K]
9298096 Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured productJul 07, 14Mar 29, 16[G03F, B32B, H05K]
9265156 Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured filmMar 27, 14Feb 16, 16[C08G, C08F, H05K]
9188871 Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereofMay 17, 13Nov 17, 15[G03F, H05K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2015/0132,647 SLURRY COMPOSITION, ELECTRODE, ELECTRODE FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY, AND METHOD OF MANUFACTURING ELECTRODE FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERYAbandonedNov 12, 14May 14, 15[H01M]
2015/0132,656 SLURRY COMPOSITION, ELECTRODE, ELECTRODE FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY, AND METHOD OF MANUFACTURING ELECTRODE FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERYAbandonedNov 12, 14May 14, 15[H01M]
2015/0041,181 PROCESS FOR THE PREPARATION OF PRINTED WIRING BOARD, LAMINATE, LAMINATE FILM AND NON-CURABLE RESIN COMPOSITION USED FOR THE PRINTED WIRING BOARD, AND PRINTED WIRING BOARD PREPARED BY THE PROCESSAbandonedAug 07, 14Feb 12, 15[H05K]
2015/0014,029 PHOTOSENSITIVE COMPOSITION, HARDENED COATING FILMS THEREFROM, AND PRINTED WIRING BOARDS USING SAMEAbandonedApr 04, 12Jan 15, 15[G03F, H05K]
2014/0374,143 DRY FILM, LAYERED STRUCTURE, PRINTED WIRING BOARD, AND PROCESS FOR PRODUCING LAYERED STRUCTUREAbandonedDec 25, 12Dec 25, 14[G03F, H05K]
2013/0260,109 PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARDAbandonedMar 14, 13Oct 03, 13[G03F, H05K]
2013/0081,858 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARDAbandonedSep 28, 12Apr 04, 13[G03F, H05K]
2013/0081,864 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARDAbandonedSep 28, 12Apr 04, 13[C08L, C08K, H05K]
2013/0085,208 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARDAbandonedSep 28, 12Apr 04, 13[C08L, C08K]
2012/0056,950 METHOD FOR PRODUCING LIQUID EJECTING RECORDING HEADAbandonedNov 14, 11Mar 08, 12[B23P, B41J]
2010/0249,279 THERMALLY CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOFAbandonedMar 19, 10Sep 30, 10[C08K]
2009/0306,243 COMPOSITION FOR FORMING CURED FILM PATTERN AND METHOD FOR PRODUCING CURED FILM PATTERN BY USING THE SAMEAbandonedAug 12, 09Dec 10, 09[C08F]
2009/0194,319 PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARDAbandonedFeb 20, 09Aug 06, 09[G03F, H05K]
2009/0141,505 WHITE HEAT-HARDENING RESIN COMPOSITION, HARDENED MATERIAL, PRINTED-WIRING BOARD AND REFLECTION BOARD FOR LIGHT EMITTING DEVICEAbandonedNov 26, 08Jun 04, 09[F21V, C08L, H05K]
7517632 Silver paste composition, method of forming conductive pattern by using the same, and the conductive pattern formedExpiredJan 11, 08Apr 14, 09[G03C]
2009/0053,483 PHOTOCURABLE CONDUCTIVE PASTE AND PHOTOCURABLE BLACK PASTE USED IN FORMATION OF BUS ELECTRODE HAVING DOUBLE LAYER STRUCTURE, AND PLASMA DISPLAY PANELAbandonedOct 24, 08Feb 26, 09[H01B, B32B]
2009/0035,591 FLEXIBLE LAMINATE HAVING THERMOPLASTIC POLYIMIDE LAYER AND METHOD FOR MANUFACTURING THE SAMEAbandonedSep 30, 08Feb 05, 09[B32B]
2009/0029,181 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD OBTAINED BY USING THE SAMEAbandonedSep 29, 08Jan 29, 09[C08L, B32B]
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