TECHNIC, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1041
 
 
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 4194
 
 
 
G06N COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS 264
 
 
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 1204
 
 
 
G05B CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS 1100

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9864345 Eliminating temperature variation effects to improve accuracy of electroplating bath monitoringDec 18, 14Jan 09, 18[G01N, G05B]
8440065 Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplatingJun 04, 10May 14, 13[C25D]
7431817 Electroplating solution for gold-tin eutectic alloyMay 10, 05Oct 07, 08[C25D]
7270733 Method and apparatus for real time monitoring of industrial electrolytesJul 16, 03Sep 18, 07[G06N]
7208073 Media for use in plating electronic componentsJun 16, 03Apr 24, 07[C25D]
7124120 Method and apparatus for real time monitoring of electroplating bath performance and early fault detectionJul 16, 03Oct 17, 06[G06N]
6562220 Metal alloy sulfate electroplating bathsMay 21, 01May 13, 03[C25D]
6315202 Material coding using lasersAug 11, 97Nov 13, 01[G06K]
6251253 Metal alloy sulfate electroplating bathsMar 19, 99Jun 26, 01[C25D]
6183619 Metal alloy sulfonic acid electroplating bathsMar 19, 99Feb 06, 01[C25D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0252,020 Electro-Depositing Metal Layers of Uniform ThicknessAbandonedDec 06, 11Sep 26, 13[C25D, B32B]
2009/0120,497 METHOD OF METALLIZING SOLAR CELL CONDUCTORS BY ELECTROPLATING WITH MINIMAL ATTACK ON UNDERLYING MATERIALS OF CONSTRUCTIONAbandonedNov 07, 08May 14, 09[C25D, H01L]
2009/0090,633 ELECTROPLATING SYSTEM WITH MOVABLE SUPPORT STRUCTURE PROVIDING CATHODE POTENTIALAbandonedOct 06, 08Apr 09, 09[C25D]
2009/0090,632 ELECTROPLATING SYSTEM INCLUDING INTERCHANGEABLE CARRIERS FOR SUPPORTING AND PROVIDING CATHODE POTENTIAL TO ARTICLESAbandonedOct 06, 08Apr 09, 09[C25D]
7279086 Electroplating solution for alloys of gold with tinExpiredMay 18, 04Oct 09, 07[C25D]
7270734 Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplatingExpiredJun 04, 04Sep 18, 07[C25D]
2007/0175,358 ELECTROLESS GOLD PLATING SOLUTIONAbandonedDec 05, 06Aug 02, 07[C23C, B05D]
2007/0175,359 ELECTROLESS GOLD PLATING SOLUTION AND METHODAbandonedDec 05, 06Aug 02, 07[C23C, B05D]
2007/0151,863 NON-CYANIDE SILVER PLATING BATH COMPOSITIONAbandonedNov 27, 06Jul 05, 07[C25D]
2007/0114,125 System and method for electroplating flexible substratesAbandonedNov 18, 05May 24, 07[C25D]
2007/0012,575 Bright rhodium electrodepositionAbandonedJul 12, 05Jan 18, 07[C25D]
2007/0007,144 Tin electrodeposits having properties or characteristics that minimize tin whisker growthAbandonedJun 23, 06Jan 11, 07[C25D]
2006/0292,847 Silver barrier layers to minimize whisker growth in tin electrodepositsAbandonedJun 23, 06Dec 28, 06[H01L]
2006/0237,324 Pulse plating process for deposition of gold-tin alloyAbandonedJun 21, 06Oct 26, 06[C25D]
2006/0240,276 Underlayer for reducing surface oxidation of plated depositsAbandonedApr 19, 06Oct 26, 06[C25D, B32B]
2006/0219,562 System and method of transporting and providing a cathode contact to articles in an electroplating systemAbandonedApr 01, 05Oct 05, 06[C25D]
2006/0219,563 System and method of controlling the demarcation line formed on partially electroplated articlesAbandonedApr 01, 05Oct 05, 06[C23C, C25D, C23F]
2006/0163,080 Pulse plating process for deposition of gold-tin alloyAbandonedJan 19, 06Jul 27, 06[C25D]
2006/0113,195 Near neutral pH tin electroplating solutionAbandonedNov 21, 05Jun 01, 06[C25D]
2006/0016,692 Reduction of surface oxidation during electroplatingAbandonedSep 23, 05Jan 26, 06[C23C, C25D]

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