TEGAL CORPORATION

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0120,648 APPARATUS AND A METHOD FOR CONTROLLING THE DEPTH OF ETCHING DURING ALTERNATING PLASMA ETCHING OF SEMICONDUCTOR SUBSTRATESAbandonedFeb 02, 11May 26, 11[C23F]
2007/0251,451 Nanolayer Thick Film Processing SystemAbandonedApr 24, 07Nov 01, 07[C23C]
2007/0197,039 ANISOTROPIC ETCHING METHODAbandonedJan 30, 07Aug 23, 07[H01L, C23F]
2007/0026,626 Integrated decoupling capacitor processAbandonedJul 26, 06Feb 01, 07[H01L]
2006/0207,872 Dual magnetron thin film deposition systemAbandonedMar 21, 05Sep 21, 06[C23C]
2006/0186,496 System and method for processing a wafer including stop-on-alumina processingAbandonedApr 20, 06Aug 24, 06[H01L]
2006/0189,165 Method and apparatus for non-aggressive plasma-enhanced vapor deposition of dielectric filmsAbandonedMar 10, 06Aug 24, 06[H01L]
2006/0060,566 Method and device for substrate etching with very high power inductively coupled plasmaAbandonedJul 10, 03Mar 23, 06[H01L, C23F]
2006/0051,893 Thin substrate supportAbandonedSep 07, 05Mar 09, 06[H01L]
2006/0046,412 Method and system for sequential processing in a two-compartment chamberAbandonedMay 26, 05Mar 02, 06[H01L]
2006/0040,055 Method and system for sequential processing in a two-compartment chamberAbandonedJun 23, 05Feb 23, 06[C23C]
2005/0224,178 Heating jacket for plasma etching reactor, and etching method using sameAbandonedDec 03, 04Oct 13, 05[C23F]
2005/0084,619 Method to deposit an impermeable film on porous low-k dielectric filmAbandonedOct 12, 04Apr 21, 05[C23C, B05D]
2005/0037,597 Semiconductor processing system and methodAbandonedApr 01, 03Feb 17, 05[H01L]
2005/0005,855 Plasma enhanced pulsed layer depositionAbandonedAug 10, 04Jan 13, 05[C23C]
2004/0058,293 Assembly line processing systemAbandonedAug 06, 02Mar 25, 04[F27B]
2003/0196,603 Integrated precursor delivery systemAbandonedMay 09, 03Oct 23, 03[C23C]
2002/0100,053 Semiconductor processing video monitoring systemAbandonedJan 19, 01Jul 25, 02[H04N]
6391148 Cobalt silicide etch process and apparatusExpiredJan 12, 01May 21, 02[C23F]
2001/0001,413 METHOD AND APPARATUS FOR INCREASING WAFER THROUGHPUT BETWEEN CLEANINGS IN SEMICONDUCTOR PROCESSING REACTORSAbandonedMay 28, 98May 24, 01[H01L]

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