TERAMIKROS, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 21341
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 159

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
RE43380 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofMay 06, 10May 15, 12[H01L]
8004089 Semiconductor device having wiring line and manufacturing method thereofJan 26, 09Aug 23, 11[H01L]
7972903 Semiconductor device having wiring line and manufacturing method thereofJan 26, 09Jul 05, 11[H01L]
7910405 Semiconductor device having adhesion increasing film to prevent peelingJun 12, 07Mar 22, 11[H01L]
7888238 Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizesDec 09, 08Feb 15, 11[H01L]
7863750 Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereofJul 22, 09Jan 04, 11[H01L]
7843071 Semiconductor device including wiring and manufacturing method thereofJan 23, 09Nov 30, 10[H01L]
7808073 Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing bothMar 30, 05Oct 05, 10[H01L]
7790515 Semiconductor device with no base member and method of manufacturing the sameNov 26, 07Sep 07, 10[H01L]
7709942 Semiconductor package, including connected upper and lower interconnectionsJun 02, 04May 04, 10[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8587124 Semiconductor device having low dielectric insulating film and manufacturing method of the sameExpiredJun 04, 08Nov 19, 13[H01L]
8507309 Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the sameExpiredMay 25, 11Aug 13, 13[H01L]
8421187 Semiconductor device and manufacturing method thereofExpiredAug 02, 10Apr 16, 13[H01L]
8354349 Semiconductor device having sealing film and manufacturing method thereofExpiredMar 19, 10Jan 15, 13[H01L]
8293574 Semiconductor device having a plurality of semiconductor constructsExpiredMar 08, 10Oct 23, 12[H01L]
8278734 Semiconductor device and manufacturing method thereofExpiredMar 23, 10Oct 02, 12[H01L]
8268674 Semiconductor device and method for manufacturing the sameExpiredAug 03, 10Sep 18, 12[H01L]
8154133 Semiconductor device having low dielectric constant film and manufacturing method thereofExpiredMar 27, 09Apr 10, 12[H01L]
2011/0304,043 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAMEAbandonedJun 03, 11Dec 15, 11[H01L]
2011/0133,185 SEMICONDUCTOR DEVICE FORMATION SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHODAbandonedDec 06, 10Jun 09, 11[H01L]
2011/0001,245 SEMICONDUCTOR DEVICE INCLUDING SEALING FILM FOR ENCAPSULATING SEMICONDUCTOR CHIP AND PROJECTION ELECTRODES AND MANUFACTURING METHOD THEREOFAbandonedJul 01, 10Jan 06, 11[H01L]
2011/0001,247 SEMICONDUCTOR DEVICE MANUFACTURING METHODAbandonedJun 30, 10Jan 06, 11[H01L]
2010/0233,853 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEAbandonedMar 10, 10Sep 16, 10[H01L]
RE41511 Semiconductor device having a thin-film circuit element provided above an integrated circuitExpiredMar 22, 07Aug 17, 10[H01L]
7755183 Wiring board, method of manufacturing the same, and semiconductor deviceExpiredMar 18, 05Jul 13, 10[H01L]
2010/0144,095 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILMAbandonedDec 07, 09Jun 10, 10[H01L]
2010/0144,096 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILMAbandonedDec 07, 09Jun 10, 10[H01L]
2010/0144,097 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILMAbandonedDec 07, 09Jun 10, 10[H01L]
2010/0059,895 SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LAMINATED STRUCTURE SECTION AND METHOD OF FABRICATING THE SAMEAbandonedSep 09, 09Mar 11, 10[H01L]
7592672 Grounding structure of semiconductor device including a conductive pasteExpiredMar 29, 07Sep 22, 09[H01L]

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