TESSERA TECHNOLOGIES HUNGARY KFT.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 26336
 
 
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
 
 
G03C PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES 145
 
 
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 1241

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8592831 Integrated circuit deviceOct 26, 06Nov 26, 13[H01L]
8551815 Stack packages using reconstituted wafersAug 01, 08Oct 08, 13[H01L]
8466542 Stacked microelectronic assemblies having vias extending through bond padsMar 12, 10Jun 18, 13[H01L]
7939918 Chip packages with coversOct 26, 06May 10, 11[H01L]
7935568 Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingOct 31, 06May 03, 11[H01L]
7936062 Wafer level chip packagingJan 19, 07May 03, 11[H01L]
7807508 Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingApr 25, 07Oct 05, 10[H01L]
7781240 Integrated circuit deviceOct 26, 06Aug 24, 10[H01L]
7642629 Methods and apparatus for packaging integrated circuit devicesAug 13, 07Jan 05, 10[H01L]
7495341 Methods and apparatus for packaging integrated circuit devicesJan 30, 07Feb 24, 09[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0323,475 Integrated circuit deviceAbandonedAug 20, 10Dec 23, 10[H01L]
2007/0190,747 Wafer level packaging to lidded chipsAbandonedJan 19, 07Aug 16, 07[H01L]

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