THERMAL CORP.

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Technologies

Intl Class Technology # of Patents/ App Rank in Class
 
 
 
F28D HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT 3110
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 18109
 
 
 
F28F DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION 942
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6300
 
 
 
A61B DIAGNOSIS; SURGERY; IDENTIFICATION 4201
 
 
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 360
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 3377
 
 
 
B21D WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING 247
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1150
 
 
 
B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES135

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0190,667 CAPILLARY DEVICE FOR USE IN HEAT PIPE AND METHOD OF MANUFACTURING SUCH CAPILLARY DEVICEMay 24, 12Jul 10, 14[F28D]
2014/0060,783 HEAT TRANSFER APPARATUS AND METHODMar 14, 13Mar 06, 14[F28F]
2013/0299,136 VARIABLE-CONDUCTANCE HEAT TRANSFER DEVICEMay 17, 12Nov 14, 13[F28D]
2013/0213,075 ELECTRONICS CABINET AND RACK COOLING SYSTEM AND METHODFeb 21, 13Aug 22, 13[F25D]
2013/0213,603 HEAT EXCHANGER BACKING PLATE AND METHOD OF ASSEMBLING SAMEFeb 21, 13Aug 22, 13[B23P, F28F]
2013/0092,354 HEAT PIPE HAVING A WICK WITH A HYBRID PROFILEOct 18, 12Apr 18, 13[F28D]
2013/0081,788 HEAT EXCHANGE APPARATUSJun 06, 11Apr 04, 13[F28D]
2010/0263,837 CHEMICALLY COMPATIBLE, LIGHTWEIGHT HEAT PIPEJun 29, 10Oct 21, 10[F28D, G06F]
2010/0181,056 POROUS MEDIA COLD PLATEApr 01, 10Jul 22, 10[F28F]
2009/0025,907 FLUID CIRCUIT HEAT TRANSFER DEVICE FOR PLURAL HEAT SOURCESOct 07, 08Jan 29, 09[F28D, F28F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,627,879 Capillary assisted loop thermosiphon apparatusNov 01, 10Jan 14, 14[F28D, H05K]
8,397,796 Porous media cold plateApr 01, 10Mar 19, 13[H05K]
8,286,694 Chemically compatible, lightweight heat pipeJun 29, 10Oct 16, 12[B21D, F28D, H01L]
8,230,907 Heat pipe with axial and lateral flexibilityJan 18, 10Jul 31, 12[F28D, H05K]
8,100,894 Heat pipe for cautery surgical instrumentOct 21, 04Jan 24, 12[A61B]
7,914,529 Cooling element for electrosurgeryAug 02, 05Mar 29, 11[A61B]
7,823,629 Capillary assisted loop thermosiphon apparatusMar 19, 04Nov 02, 10[F28D, H05K]
7,743,502 Chemically compatible, lightweight heat pipeFeb 28, 06Jun 29, 10[B21D, B23P, F28D, H05K, C22C]
7,690,419 Porous media cold plateMay 03, 06Apr 06, 10[H05K]
7,647,961 Heat pipe with axial and lateral flexibilityOct 24, 05Jan 19, 10[F28D, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
7,698,815 Method for forming a heat dissipation deviceApr 02, 04Apr 20, 10[B21D, B23P]
7,414,844 Liquid cooled heat sink with cold plate retention mechanismDec 12, 06Aug 19, 08[H05K]
7,407,083 Bonded silicon, components and a method of fabricating the sameAug 19, 04Aug 05, 08[B23K]
2007/0095,087 Vapor compression cooling system for cooling electronicsNov 01, 05May 03, 07[F25D, F25B, H05K]
7,159,649 Air-to-air heat exchangerJul 16, 04Jan 09, 07[F28F]
7,143,511 Method of forming a heat pipeJan 27, 06Dec 05, 06[B23P]
7,143,818 Heat pipe evaporator with porous valveJan 23, 06Dec 05, 06[F28D]
7,137,443 Brazed wick for a heat transfer device and method of making sameFeb 10, 05Nov 21, 06[B22F]
2006/0243,425 INTEGRATED CIRCUIT HEAT PIPE HEAT SPREADER WITH THROUGH MOUNTING HOLESJul 14, 06Nov 02, 06[H05K]
7,129,731 Heat pipe with chilled liquid condenser system for burn-in testingAug 30, 04Oct 31, 06[G01R]
7,124,809 Brazed wick for a heat transfer deviceApr 06, 05Oct 24, 06[F28D]
2006/0185,836 Thermally coupled surfaces having controlled minimum clearanceFeb 24, 05Aug 24, 06[H05K]
7,090,002 Deformable end cap for heat pipeNov 08, 04Aug 15, 06[F28D]
7,028,759 Heat transfer device and method of making sameJan 27, 04Apr 18, 06[F28D]
7,013,955 Flexible loop thermosyphonFeb 25, 04Mar 21, 06[F28D]
7,013,958 Sintered grooved wick with particle webMay 13, 05Mar 21, 06[F28D]
6,997,245 Vapor chamber with sintered grooved wickDec 03, 04Feb 14, 06[F28D]
6,966,361 Bi-level heat sinkOct 25, 02Nov 22, 05[H05K]
6,938,680 Tower heat sink with sintered grooved wickJul 14, 03Sep 06, 05[0000]
6,926,072 Hybrid loop heat pipeOct 22, 03Aug 09, 05[F28D]

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