THERMOCARBON, INC.

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Patent Activity in the Last 10 Years

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
D387364 Semiconductor wafer dicing sawJun 25, 96Dec 09, 97[1509]
D381668 Semiconductor wafer dicing sawJun 25, 96Jul 29, 97[1509]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6659843 Substrate dicing methodExpiredFeb 13, 02Dec 09, 03[B24B]
6354909 Substrate dicing methodExpiredAug 25, 00Mar 12, 02[B24B]
6152803 Substrate dicing methodExpiredJul 21, 99Nov 28, 00[B24B]
5934973 Semiconductor wafer dicing sawExpiredFeb 12, 98Aug 10, 99[B24B]
5819931 Package useful in storing and handling fragile dicing bladeExpiredMar 24, 97Oct 13, 98[B65D, A45C]
5718615 Semiconductor wafer dicing methodExpiredOct 20, 95Feb 17, 98[B24B, B28D]
5676360 Machine tool rotary table locking apparatusExpiredJul 11, 95Oct 14, 97[B23Q]
5613350 Method for packaging and handling fragile dicing bladeExpiredApr 20, 95Mar 25, 97[B65B]
4787362 Abrasive blade having a polycrystalline ceramic coreExpiredApr 01, 88Nov 29, 88[B28D]

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