THIN FILM MODULE, INC.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6586846 Low cost decal material used for packagingExpiredMay 02, 01Jul 01, 03[H01L]
6562656 Cavity down flip chip BGAExpiredJun 25, 01May 13, 03[H01L]
6455926 High density cavity-up wire bond BGAExpiredJul 09, 01Sep 24, 02[H01L]
6331447 High density flip chip BGAExpiredApr 20, 01Dec 18, 01[H01L]
6320256 Quick turn around fabrication process for packaging substrates and high density cardsExpiredFeb 02, 01Nov 20, 01[H01L]
6294477 Low cost high density thin film processingExpiredDec 20, 99Sep 25, 01[H01L]
6291268 Low cost method of testing a cavity-up BGA substrateExpiredJan 08, 01Sep 18, 01[H01L]
6287890 Low cost decal material used for packagingExpiredOct 18, 99Sep 11, 01[H01L]
6277672 BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technologyExpiredSep 03, 99Aug 21, 01[H01L]
6242279 High density wire bond BGAExpiredJun 14, 99Jun 05, 01[H01L]
6221693 High density flip chip BGAExpiredJun 14, 99Apr 24, 01[H01L]
6197614 Quick turn around fabrication process for packaging substrates and high density cardsExpiredDec 20, 99Mar 06, 01[H01L]

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