TOKUYAMA SEKISUI CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 696
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 375
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 3113
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2123
 
  
 
B01J CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS 1108
 
  
 
F16L PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL169

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0008,981 PRODUCTION METHOD FOR CHLORINATED VINYL CHLORIDE RESINMar 31, 15Jan 12, 17[C08F]
2014/0336,321 CHLORINATED VINYL CHLORIDE RESIN COMPOSITION FOR EXTRUSION MOLDINGNov 29, 12Nov 13, 14[C08K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9765195 Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereofOct 13, 16Sep 19, 17[C08K]
9758633 Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereofOct 13, 16Sep 12, 17[C08K]
9611373 Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereofSep 26, 14Apr 04, 17[C08L, C08K]
9611374 Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereofSep 26, 14Apr 04, 17[C08L, C08K]
9493625 Thermally expanding microcapsulesSep 22, 14Nov 15, 16[C08J, B01J]
9346901 Method for producing chlorinated vinyl chloride resinNov 30, 12May 24, 16[C08F]
7319114 Hollow polymer particles, method for preparing hollow polymer particles, porous ceramic filter, and method for preparing porous ceramic filterMar 12, 02Jan 15, 08[C08J]
6617363 Method of producing thermally expansive microcapsuleJan 17, 02Sep 09, 03[C08J, B01J]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0345,886 THERMALLY EXPANDABLE MULTILAYER PACKING FOR BUILDING MATERIALAbandonedNov 29, 12Nov 27, 14[A62C]
2010/0063,247 CHLORINATED VINYL CHLORIDE-BASED RESIN AND MANUFACTURING METHODAbandonedNov 24, 06Mar 11, 10[C08G]

Top Inventors for This Owner

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