TOKYO SEIMITSU CO., LTD.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS3168
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 2343
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 14145
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 9353
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM8149
 
  
 
G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR 654
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 4443
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 4194
 
  
 
B28D WORKING STONE OR STONE-LIKE MATERIALS 319

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0322,016 THREE-DIMENSIONAL COORDINATE MEASUREMENT APPARATUSJul 27, 17Nov 09, 17[G01B, G01D]
2017/0146,595 POSITIONING AND FIXING DEVICEFeb 08, 17May 25, 17[G01R]
2017/0010,323 Semiconductor Wafer Inspection Apparatus And Semiconductor Wafer Inspection MethodAug 12, 16Jan 12, 17[H01L, G01R]
2015/0099,428 Dicing Device and Dicing MethodDec 12, 14Apr 09, 15[B24B]
2007/0284,028 PEELING TAPE ADHERING METHOD AND PEELING TAPE ADHERING DEVICEMay 24, 07Dec 13, 07[B32B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9921049 Three-dimensional coordinate measurement apparatusJul 27, 17Mar 20, 18[G01B, G01D]
9874429 Three-dimensional coordinate measuring machineAug 23, 16Jan 23, 18[G01B]
9869715 Semiconductor wafer inspection apparatus and semiconductor wafer inspection methodAug 12, 16Jan 16, 18[H01L, G01R]
9829303 Shape measuring apparatusApr 26, 17Nov 28, 17[G01B]
9778075 Rotation angle measurement device and rotation angle measurement methodApr 26, 16Oct 03, 17[G01D]
9719769 Bidirectional displacement detectorJul 11, 16Aug 01, 17[G01B]
9701043 Dicing bladeApr 24, 13Jul 11, 17[B24B, B28D, B24D]
9685355 Laser dicing device and dicing methodAug 30, 16Jun 20, 17[H01L, B23K]
9664733 Probe device for testing electrical characteristics of semiconductor elementAug 24, 15May 30, 17[G01R]
9581424 Roundness measuring apparatusDec 09, 14Feb 28, 17[G01B]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0153,771 Shape Measuring DeviceAbandonedJul 23, 15Jun 02, 16[G01B]
8065031 Polishing end point detection method utilizing torque change and device thereofExpiredSep 10, 07Nov 22, 11[B24B, G01L, G05B, G06F, H03F]
7981770 Wafer machining method for preparing a wafer for dicingExpiredFeb 28, 07Jul 19, 11[H01L]
2011/0136,078 IMPLANT BODY, METHOD OF MANUFACTURE OF SAME, AND DENTAL IMPLANTAbandonedMay 29, 09Jun 09, 11[A61C]
7830141 Film thickness measuring apparatus and film thickness measuring methodExpiredJan 07, 09Nov 09, 10[G01B, G01R]
7821257 Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thicknessExpiredAug 18, 08Oct 26, 10[B24B, G01B, G01R]
7785175 Method and apparatus for chemical mechanical polishingExpiredMay 20, 05Aug 31, 10[B24B]
7753761 Wafer polishing apparatus and wafer polishing methodExpiredNov 17, 06Jul 13, 10[B24B]
2010/0120,336 Polishing method and polishing apparatusAbandonedOct 29, 09May 13, 10[B24B]
7632169 Polishing method and polishing apparatusExpiredMay 25, 07Dec 15, 09[B24B]
2009/0259,435 Roundness Measuring Instrument and Method of Determining Quality of Tip HeadAbandonedDec 01, 06Oct 15, 09[G01B]
7601615 Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatusExpiredOct 30, 06Oct 13, 09[H01L]
2009/0247,050 GRINDING METHOD FOR GRINDING BACK-SURFACE OF SEMICONDUCTOR WAFER AND GRINDING APPARATUS FOR GRINDING BACK-SURFACE OF SEMICONDUCTOR WAFER USED IN SAMEAbandonedMar 04, 09Oct 01, 09[B24B]
2009/0246,955 WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUSAbandonedDec 11, 08Oct 01, 09[B24B, H01L]
7565002 Wafer surface observation apparatusExpiredNov 06, 01Jul 21, 09[G06K]
7521384 Method and apparatus for peeling surface protective filmExpiredOct 05, 06Apr 21, 09[H01L]
7501843 Movement amount operation correction method for prober, movement amount operation correction processing program, and proberExpiredApr 27, 06Mar 10, 09[G01R]
7492942 Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatusExpiredAug 17, 05Feb 17, 09[G06K]
2009/0035,879 LASER DICING DEVICE AND LASER DICING METHODAbandonedSep 26, 06Feb 05, 09[H01L, B23K]
2009/0025,464 Surface-roughness/contour measuring apparatusAbandonedMay 29, 06Jan 29, 09[G01B]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.