TOSOH SMD, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 2576
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1083
 
  
 
C22C ALLOYS 765
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 6122
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 547
 
  
 
B21D WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING 452
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 4202
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 254
 
  
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 235
 
  
 
C25B ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR 233

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0044,778 SPUTTERING TARGET HAVING REVERSE BOWNG TARGET GEOMETRYFeb 23, 16Feb 15, 18[C23C, H01J, C22C]
2017/0098,529 RADIO FREQUENCY IDENTIFICATION IN-METAL INSTALLATION AND ISOLATION FOR SPUTTERING TARGETMay 13, 15Apr 06, 17[H01J, C23C, G06K]
2017/0022,603 BORON-DOPED N-TYPE SILICON TARGETMar 18, 15Jan 26, 17[C23C, H01J, C30B]
2016/0298,228 SOFT-MAGNETIC BASED TARGETS HAVING IMPROVED PASS THROUGH FLUXApr 08, 16Oct 13, 16[C23C, H01J, B22F]
2016/0229,029 OPTIMIZED TEXTURED SURFACES AND METHODS OF OPTIMIZINGOct 08, 14Aug 11, 16[H01J, C23C, B24C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9831073 Low deflection sputtering target assembly and methods of making sameFeb 12, 13Nov 28, 17[C23C, H01J, C25D, B23K]
9566618 Silicon sputtering target with special surface treatment and good particle performance and methods of making the sameNov 07, 12Feb 14, 17[C23C, H01J, B08B]
9546418 Diffusion-bonded sputter target assembly and method of manufacturingFeb 09, 12Jan 17, 17[C23C, H01J]
9150956 Monolithic aluminum alloy target and method of manufacturingJul 26, 13Oct 06, 15[C23C, B21J, B21C, C22F, C22C]
9150957 Method of making a sputter target and sputter targets made therebyNov 03, 09Oct 06, 15[C23C, C22F, C22C]
8992748 Sputtering targetJun 18, 12Mar 31, 15[C23C, H01J]
8556681 Ultra smooth face sputter targets and methods of producing sameJan 29, 08Oct 15, 13[B24B]
8551267 Monolithic aluminum alloy target and method of manufacturingJan 06, 10Oct 08, 13[C23C]
8506882 High purity target manufacturing methodsApr 28, 09Aug 13, 13[B22F]
8235277 Sputtering target assembly and method of making sameSep 13, 11Aug 07, 12[B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8453487 Circular groove pressing mechanism and method for sputtering target manufacturingExpiredOct 09, 09Jun 04, 13[B21D]
2012/0305,393 SPUTTER TARGETAbandonedFeb 16, 11Dec 06, 12[C23C, B23P, B05D]
2012/0267,243 SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLYAbandonedJul 03, 12Oct 25, 12[C23C, B23K]
8037727 Non-planar sputter targets having crystallographic orientations promoting uniform depositionExpiredMay 29, 09Oct 18, 11[C23C, B23K, B21D]
2011/0203,921 METHOD OF BONDING ROTATABLE CERAMIC TARGETS TO A BACKING STRUCTUREAbandonedFeb 17, 11Aug 25, 11[C23C, B23P]
2011/0139,614 SPUTTERING TARGET WITH AN INSULATING RING AND A GAP BETWEEN THE RING AND THE TARGETAbandonedFeb 21, 11Jun 16, 11[C23C]
2010/0051,453 Process for making dense mixed metal Si3N4 targetsAbandonedNov 05, 09Mar 04, 10[C23C, B22F]
2010/0038,241 Systems and methods for a target and backing plate assemblyAbandonedSep 21, 09Feb 18, 10[C23C, B23K]
2010/0000,860 Copper Sputtering Target With Fine Grain Size And High Electromigration Resistance And Methods Of Making the SameAbandonedAug 29, 07Jan 07, 10[C23C, B22D, C22F, C22C]
7561937 Automated sputtering target productionExpiredJan 18, 06Jul 14, 09[G06F]
2009/0160,137 Low leak O-ring sealAbandonedFeb 24, 09Jun 25, 09[F16J]
7480976 Automated sputtering target production and sub systems thereofExpiredJan 18, 06Jan 27, 09[B23Q]
2009/0022,982 Electronic Device, Method of Manufacture of Same and Sputtering TargetAbandonedFeb 21, 07Jan 22, 09[C23C, B23P, B32B]
2009/0008,786 Sputtering TargetAbandonedFeb 26, 07Jan 08, 09[H01L, C22C]
2008/0271,305 Automated Sputtering Target ProductionAbandonedJan 18, 06Nov 06, 08[B23Q]
2008/0203,641 End Effector For Handling Sputter TargetsAbandonedJan 18, 06Aug 28, 08[C23C, B25B]
2008/0029,972 Low Leak O-Ring SealAbandonedOct 07, 05Feb 07, 08[F16J]
2007/0243,095 High Purity Target Manufacturing MethodsAbandonedJun 01, 05Oct 18, 07[B22F]
2007/0227,688 Continuous Casting of Copper to Form Sputter TargetsAbandonedJun 15, 05Oct 04, 07[B22D]
2007/0158,178 Method and apparatus for deposition of low-k dielectric materialsAbandonedJul 22, 03Jul 12, 07[C23C]

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