TOWA CORPORATION

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 16109
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 249
 
  
 
A23G COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF 129
 
  
 
B23B TURNING; BORING 151
 
  
 
B26D CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 136
 
  
 
C04B LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS 167
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0151,946 MOLDED ARTICLE PRODUCTION SYSTEM AND MOLDED ARTICLE PRODUCTION METHODNov 12, 15Jun 02, 16[B29C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9728426 Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like memberDec 23, 14Aug 08, 17[C25D, H01L]
9595483 Cutting device and cutting methodMar 23, 16Mar 14, 17[B26D, H01L]
9580827 Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like memberJun 30, 15Feb 28, 17[C25D, H01L, H05K]
D770724 Pair of working glovesApr 27, 15Nov 08, 16[0206]
8771563 Manufacturing method of optical electronic components and optical electronic components manufactured using the sameFeb 06, 07Jul 08, 14[B29C]
8696951 Manufacturing method of optical electronic components and optical electronic components manufactured using the sameFeb 06, 07Apr 15, 14[B29C]
8684718 Compression molding method for electronic component and compression molding apparatus employed thereforDec 22, 11Apr 01, 14[H01L, B29C, A23G]
8222059 Method transparent member, optical device using transparent member and method of manufacturing optical deviceJun 27, 08Jul 17, 12[H01L]
8193558 Optical electronic componentSep 12, 08Jun 05, 12[H01L]
7985357 Method of resin-sealing and molding an optical deviceSep 22, 06Jul 26, 11[B29C]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0017,372 METHOD OF MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND APPARATUS FOR MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENTAbandonedNov 08, 12Jan 15, 15[H01L, B29C]
2011/0233,821 COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFORAbandonedSep 25, 09Sep 29, 11[B29C]
2011/0193,261 COMPRESSION MOLDING METHOD AND COMPRESSION MOLDING APPARATUSAbandonedOct 16, 09Aug 11, 11[B29C]
2010/0065,983 METHOD OF COMPRESSION-MOLDING LIGHT-EMITTING ELEMENTSAbandonedFeb 13, 08Mar 18, 10[B29C]
2010/0006,215 METHOD OF FORMING LIGHT EMITTER AND MOLDING DIEAbandonedDec 13, 07Jan 14, 10[B29C, B29D]
2009/0291,532 METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PARTAbandonedApr 13, 07Nov 26, 09[H01L]
2009/0279,775 METHOD OF INSPECTING MOUNTING STATES OF ELECTRONIC COMPONENTSAbandonedAug 27, 07Nov 12, 09[G06K]
2009/0242,524 SINGULATION APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENTAbandonedNov 07, 07Oct 01, 09[B23K, B26F]
2009/0189,310 SEMICONDUCTOR CHIP COMPRESSION MOLDING METHOD AND MOLD FOR COMPRESSION MOLDINGAbandonedJan 28, 09Jul 30, 09[B29C, B28B]
2009/0162,467 Resin Sealing/Molding ApparatusAbandonedJan 26, 07Jun 25, 09[B29C]
2009/0162,471 Resin-Sealing and Molding Apparatus with Sealing Mechanism and Method of dismounting Contitiuent Part of Die Assembly Fitted ThereinAbandonedNov 01, 06Jun 25, 09[B23P, B29C]
2009/0126,543 System and method for supplying processing waterAbandonedNov 05, 08May 21, 09[B24C]
2009/0127,732 METHOD OF COMPRESSION-MOLDING ELECTRONIC COMPONENTS AND MOLDAbandonedNov 13, 08May 21, 09[B29C]
2009/0124,178 Abrasive Waterjet Type Cutting ApparatusAbandonedDec 28, 06May 14, 09[B24C]
2009/0114,937 RESIN-SEALED LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHODAbandonedOct 31, 08May 07, 09[H01L]
2009/0102,093 METHOD OF SEALING AND MOLDING ELECTRONIC COMPONENT WITH RESIN AND MOLDAbandonedOct 07, 08Apr 23, 09[B29C]
2009/0091,048 Method of Sealing and Molding an Optical Device With ResinAbandonedDec 15, 06Apr 09, 09[B29D]
2009/0068,302 Resin Sealing and Molding Apparatus for Electronic ComponentAbandonedOct 17, 06Mar 12, 09[B29C]
2008/0296,532 Low Adhesion Material, Resin Molding Die, and Soil Resistant MaterialAbandonedDec 27, 06Dec 04, 08[C09K, B28B]
7407146 Composite material and resin moldExpiredDec 30, 04Aug 05, 08[B29C]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.