TRIQUINT SEMICONDUCTOR, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 764
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359
 
  
 
H03G CONTROL OF AMPLIFICATION 349
 
  
 
H03K PULSE TECHNIQUE 3128
 
  
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 258
 
  
 
H03F AMPLIFIERS 281
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1103
 
  
 
H01Q AERIALS 1109
 
  
 
H01S DEVICES USING STIMULATED EMISSION191
 
  
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 176

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9276304 Power combiner using tri-plane antennasNov 26, 12Mar 01, 16[H01P, H01Q]
9166548 Acoustic wave filter manufacturing method using photo-definable epoxy for suppression of unwanted acoustic energyJul 28, 10Oct 20, 15[H04R, H03H]
8952768 Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filtersAug 20, 13Feb 10, 15[H03H]
8767366 Electrostatic discharge protection circuit for compound semiconductor devices and circuitsJan 26, 12Jul 01, 14[H02H]
8525620 BAW resonator filter bandwidth and out-of-band frequency rejectionNov 30, 09Sep 03, 13[H03H]
8031034 Surface acoustic wave filter and method for improved rejectionSep 02, 10Oct 04, 11[H03H]
7960097 Methods of minimizing etch undercut and providing clean metal liftoffOct 30, 07Jun 14, 11[G03F]
7655546 Monolithic integrated enhancement mode and depletion mode field effect transistors and method of making the sameOct 11, 05Feb 02, 10[H01L]
7453334 Leaky SAW resonator and methodMar 21, 06Nov 18, 08[H03H]
7148748 Active protection circuit for load mismatched power amplifierJul 02, 04Dec 12, 06[H03G]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0106,511 FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONSAbandonedDec 16, 13Apr 17, 14[H01L]
2013/0320,349 IN-SITU BARRIER OXIDATION TECHNIQUES AND CONFIGURATIONSAbandonedMay 30, 12Dec 05, 13[H01L]
2013/0234,344 FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONSAbandonedMar 06, 12Sep 12, 13[H01L]
2013/0119,404 DEVICE STRUCTURE INCLUDING HIGH-THERMAL-CONDUCTIVITY SUBSTRATEAbandonedJan 07, 13May 16, 13[H01L]
2013/0105,817 HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE AND METHODAbandonedOct 26, 11May 02, 13[H01L]
2013/0099,284 GROUP III-NITRIDE METAL-INSULATOR-SEMICONDUCTOR HETEROSTRUCTURE FIELD-EFFECT TRANSISTORSAbandonedOct 20, 11Apr 25, 13[H01L]
2013/0087,379 HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHODAbandonedOct 10, 11Apr 11, 13[H05K]
2012/0280,755 FLIP-CHIP POWER AMPLIFIER AND IMPEDANCE MATCHING NETWORKAbandonedMay 04, 11Nov 08, 12[H01L, H03F]
2012/0153,356 HIGH ELECTRON MOBILITY TRANSISTOR WITH INDIUM GALLIUM NITRIDE LAYERAbandonedDec 20, 10Jun 21, 12[H01L]
2012/0094,418 Wafer Level Package and Manufacturing Method Using Photodefinable Polymer for Enclosing Acoustic DevicesAbandonedOct 18, 10Apr 19, 12[H01L]
7977708 HBT/FET process integrationWithdrawnNov 15, 07Jul 12, 11[H01L]
2010/0072,484 HETEROEPITAXIAL GALLIUM NITRIDE-BASED DEVICE FORMED ON AN OFF-CUT SUBSTRATEAbandonedSep 23, 08Mar 25, 10[H01L]
2010/0001,814 THIN FILM ACOUSTIC REFLECTOR STACKAbandonedDec 07, 05Jan 07, 10[C23C, H03H]
7635636 Wafer level packaging of materials with different coefficients of thermal expansionExpiredAug 01, 06Dec 22, 09[H01L]
7546089 Switchable directional coupler for use with RF devicesExpiredJul 11, 05Jun 09, 09[H04B]
7529533 Configurable homodyne/heterodyne radio receiver and RFID reader employing sameExpiredNov 15, 05May 05, 09[H04B]
2009/0053,401 Piezoelectric deposition for BAW resonatorsAbandonedAug 24, 07Feb 26, 09[B05D]
7321132 Multi-layer structure for use in the fabrication of integrated circuit devices and methods for fabrication of sameExpiredMar 15, 05Jan 22, 08[H01L]
2007/0163,802 Electronic package including an electromagnetic shieldAbandonedJan 19, 06Jul 19, 07[H05K]
2007/0080,750 High efficiency amplifiers having multiple amplification pathsAbandonedAug 31, 05Apr 12, 07[H04B, H01Q, H03F]

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