Teka Interconnections Systems, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 2131
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7754979 Solder-bearing wafer for use in soldering operationsDec 01, 06Jul 13, 10[H01R, H05K]
7259335 Solder-bearing wafer for use in soldering operationsNov 04, 04Aug 21, 07[H05K]
6900393 Solder-bearing wafer for use in soldering operationsSep 20, 00May 31, 05[H05K]
6543129 Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connectorMar 07, 01Apr 08, 03[H01R]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2002/0061,687 Solder bearing grid arrayAbandonedNov 21, 01May 23, 02[H01R]
6206735 Press fit print circuit board connectorExpiredAug 28, 98Mar 27, 01[H01R]

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